Connecting method of printed circuit board substrates

Abstract

A connecting method of printed circuit board substrates on one side comprises the steps of performing cutting, namely cutting and removing the poor portions in a first printed circuit board substrate and a second printed circuit board substrate; performing configuration, namely configuring the first printed circuit board substrate and the second printed circuit board substrate without the poor portions in the cutting step to enable the two printed circuit board substrates to be connected; performing bonding, namely bonding fixing adhesive tapes on the upper portion and the lower portion of the connecting portion connected with the first printed circuit board substrate without the poor portion and the second printed circuit board substrate without the poor portion, wherein the first printed circuit board substrate without the poor portion and the second printed circuit board substrate without the poor portion are configured and connected in the configuration step; forming an injection holes, namely forming the adhesive injection hole in any one of the fixing adhesive tapes bonded on the upper portion and the lower portion of the connecting portion; performing injection, namely injecting an adhesive into the connecting portion for the first printed circuit board substrate without the poor portion and the second printed circuit board substrate without the poor portion through the adhesive injection hole; and performing adhesive curing.

Description

technical field [0001] The present invention relates to a method for connecting printed circuit board substrates, in particular to a method for connecting printed circuit board substrates with defective parts removed. Background technique [0002] In the existing substrate, the same circuit pattern (pattern) is printed on both sides of the substrate respectively, and after forming it into a substrate shape, the inspection operation of the circuit pattern on both sides of the substrate using a jig and fixture (Jig&Fixture) is performed on the substrate. Good products and defective products are measured, and the good product substrate without abnormality is used as a product, and when it is judged to be defective, the above-mentioned substrate is disposed of. layer. [0003] However, in the case of a printed circuit board substrate that is printed on both sides of the substrate sequentially, there is a disadvantage that if an abnormality occurs on only one of the two sides, t...

AI Technical Summary

Problems solved by technology

[0003] However, in the case of a printed circuit board substrate that is printed on both sides of the substrate sequentially, there is a disadvantage that if an abnormality occurs on only one of the two sides, the printed circuit pattern on the other side without abnormality will also be printed. Dispose of as a whole together with the substrate

[0006] just, as figure 2 As shown, in the existing connection method, the adhesive is directly injected through the gap of the printed circuit board connection part. If the injection amount of the adhesive is too much, it will harden to be higher than the substrate, which will cause contamination of other substrates. In addition, If the injection amount is too small, the adhesive force will become weaker and weaker than the impact

[0007] In other words, the existing method causes the problem of increasing the consumption of the adhesive, or the problem of contaminating the substrate when the operator is negligent, and the narrow gap of the connection part is easy to break, so that the strength will be reduced when bonding. weak

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