Single-face corrosion device applicable to semiconductor chip

Abstract

The invention relates to a single-face corrosion device applicable to a semiconductor chip. The single-face corrosion device comprises a workbench (1), corrosion systems (2), a liquid feeding system (3) and a circulation reverse-flow system (4). Each corrosion system (2) comprises a groove body (21), wherein a corrosive liquid injection port (22) is formed in the bottom of each groove body (21), a first damping plate (23) is arranged on an outlet of each corrosive liquid injection port (22), a second damping plate (24) is arranged in the middle of each groove body (21), each second damping plate (24) is vertically provided with a plurality of piece bearing pillars (25), and overflow holes (26) are formed in the groove wall of the upper portion of each groove body (21). The liquid feeding system (3) comprises a liquid storage tank (31) and a liquid feeding pump (32). The circulation reverse-flow system (4) comprises a third pipeline (41). According to the single-face corrosion device applicable to the semiconductor chip, a traditional single-face corrosion device is changed, the semiconductor chip can be fully corroded, corrosion semi-automation is achieved, and meanwhile product reliability and working efficiency are effectively improved.

Description

technical field [0001] The invention relates to a single-side etching device suitable for semiconductor chips. It belongs to the technical field of integrated circuit or discrete device chip manufacturing. Background technique [0002] With the intensification of market competition in recent years, packaging manufacturers have put forward higher requirements for product yield, reliability, surface and other aspects. In order to improve the reliability of products, semiconductor manufacturers also meet the requirements of subsequent semiconductor packaging manufacturers on the front side of semiconductor chips. In order to meet the requirements of pressing the aluminum layer and other requirements, various semiconductor manufacturers have begun to adopt a new process-one-side etching process. However, there are various deficiencies in the single-side etching devices adopted by various manufacturers at present. [0003] Before the present invention was made, the commonly use...

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Problems solved by technology

[0006] 1. The requirements for operators are high, and the corrosive liquid is easy to corrode the front;

[0007] 2. Bubbles are easy to remain in the center of the semiconductor chip, and local corrosion is uneven;

[0008] 3. The work efficiency is low, and the corrosive liquid has a strong suction force on the chip, which is easy to fragment

[0011] 1. The waste of corrosive liquid and water is serious and the cost is high;

[0012] 2. The operation is complicated, and the thin slices cannot be processed;

[0013] 3. Low work efficiency

[0015] The existing two devices have disadvantages such as low work efficiency, high cost, poor reliability, complicated operation, etc., but this device overcomes the above deficiencies

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