Wafer-processing tape and method for manufacturing semiconductor device using same

Abstract

The purpose of the present invention is to provide a wafer-processing tape that does not result in displacement at the interface between the adhesive layer and the sticky agent layer due to expansion, that has uniform expansion properties suitable for a step for dividing the adhesive layer, and that has excellent pickup performance. In the present invention, the wafer-processing tape is characterized by comprising: a substrate film; a sticky agent layer formed on the substrate film; and an adhesive layer formed on the sticky agent layer; the shear force of the sticky agent layer and the adhesive layer at 25 DEG C being no less than 0.2 N / mm2, and the peeling force between the sticky agent layer and the adhesive layer at a peeling angle of 180 DEG and a peeling speed of 300 mm / min in a standard state compliant with JIS-Z0237 after being irradiated by an energy beam of 200 mJ / cm2 being no greater than 0.3 N / 25 mm.

Description

technical field [0001] The present invention relates to an expandable wafer processing tape or the like used when an adhesive layer is cut along a chip by expansion in a manufacturing process of a semiconductor device. Background technique [0002] In the manufacturing process of semiconductor devices such as ICs, the following processes are carried out: back grinding process, which grinds the back of the wafer to make the wafer thinner after the circuit pattern is formed; After processing the tape, the wafer is cut into chip units; the expansion process is to expand (expand) the tape for wafer processing; the pick-up process is to pick up the cut chip; the die bonding (mount) process, further Bond the picked-up chip to a lead frame or package substrate (or, in a stacked package, laminate and bond chips to each other). [0003] In the above-mentioned back grinding process, a surface protection tape is used to protect the circuit pattern formation surface (wafer surface) of ...

AI Technical Summary

Problems solved by technology

This is because when the interface between the adhesive layer and the adhesive layer deviates, sufficient pulling force cannot be transmitted to the adhesive layer at that point, and the adhesive layer cannot be cut.

[0011] However, in general, when using a tape for wafer processing that is designed so that the interface between the adhesive layer and the adhesive layer does not shift, there is a problem that the chip that is divided in the pick-up process cannot be peeled off.

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