Unlock instant, AI-driven research and patent intelligence for your innovation.

Method for welding conducting wires of semiconductor refrigerating plates

A welding method and refrigeration chip technology, applied in welding equipment, manufacturing tools, metal processing equipment, etc., can solve the problems of easy contact with grains, small gaps, short circuits, etc. of solder joints, and achieve easy mastery, high production efficiency, The effect of simple process

Inactive Publication Date: 2013-12-25
KUNSHAN AODELU AUTOMATION TECH
View PDF3 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

At present, due to the relatively small gap between the large deflector and the crystal grain of the semiconductor refrigeration component, the solder joint is easy to touch the crystal grain during welding, resulting in short circuit and virtual soldering.

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0013] A wire welding method for a semiconductor refrigerating sheet, comprising the following steps:

[0014] (1) First, cut and strip the wire, the length is 300mm, and the core wire is exposed, and the exposed length is 30mm; the core wire is twisted into strands;

[0015] (2) Cut the interface part into 90 degrees, no burr incision; add strong insulating material;

[0016] (3) Welding by flame brazing technology: the gas flame adopts a micro-carbonization flame, heats the wire, and coats a layer of brazing material when it reaches 500 ° C. The brazing material is brazing material HL306.

Embodiment 2

[0018] A wire welding method for a semiconductor refrigerating sheet, comprising the following steps:

[0019] (1) First, cut and strip the wire, the length is 340mm, expose the core wire, the exposed length is 40mm; twist the core wire into strands;

[0020] (2) Cut the interface part into 90 degrees, no burr incision; add strong insulating material;

[0021] (3) Welding by flame brazing technology: the gas flame adopts a micro-carbonization flame, heats the wire, and coats a layer of brazing material when it reaches 600 ° C. The brazing material is brazing material HL308.

Embodiment 3

[0023] A wire welding method for a semiconductor refrigerating sheet, comprising the following steps:

[0024] (1) First, cut and strip the wire, the length is 320mm, and expose the core wire, the exposed length is 35mm; twist the core wire into strands;

[0025] (2) Cut the interface part into 90 degrees, no burr incision; add strong insulating material;

[0026] (3) Welding by flame brazing technology: the gas flame adopts a micro-carbonization flame, heats the wire, and coats a layer of brazing material when it reaches 550 ° C. The brazing material is brazing material HL306.

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention discloses a method for welding conducting wires of semiconductor refrigerating plates. The method has the advantages that the cut conducting wires are welded by means of flame brazing, so that a process is simple, the maneuverability, the production efficiency and the welding speed are high, the labor intensity, energy consumption and the cost are low, the method is easy to master, and the welding success rate can be effectively increased.

Description

technical field [0001] The invention relates to the field of semiconductor manufacturing methods, in particular to a wire welding method for semiconductor refrigeration chips. Background technique [0002] A semiconductor cooler, also called a thermoelectric cooler, is a heat pump. Its advantage is that there are no sliding parts, and it is used in some occasions where the space is limited, the reliability is high, and there is no refrigerant pollution. Utilizing the Peltier effect of semiconductor materials, when direct current passes through a galvanic couple formed by two different semiconductor materials in series, heat can be absorbed and released at both ends of the galvanic couple, which can achieve the purpose of cooling. It is a refrigeration technology that produces negative thermal resistance, is characterized by no moving parts, and is relatively reliable. Using semiconductor refrigeration to solve the heat dissipation problem of LED lighting systems has high p...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Applications(China)
IPC IPC(8): B23K1/00B23K1/20
Inventor 郁彬
Owner KUNSHAN AODELU AUTOMATION TECH