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Manufacturing method for printed circuit board and printed circuit board

A technology of printed circuit boards and manufacturing methods, which is applied in the fields of printed circuit manufacturing, printed circuits, printed circuit components, etc., and can solve the problem of difficult control of clamping voltage, static protection materials that cannot effectively protect circuits or electronic components, and electrostatic protection It is difficult to control the thickness accuracy of the layer and other problems, so as to avoid damage, ensure accurate thickness and improve precision

Active Publication Date: 2013-12-25
NEW FOUNDER HLDG DEV LLC +2
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Since the protective layer usually contains a polymer matrix or adhesive, the polymer matrix or adhesive itself is easily ablated by the laser. Therefore, when the blind hole is formed by laser drilling, it is difficult to avoid the laser alignment in the blind hole. The electrostatic protection material of the electrostatic protection layer at the bottom position is in contact and is ablated by the laser, which makes it difficult to control the thickness accuracy of the electrostatic protection layer, resulting in the inability to ensure the uniformity of the thickness of the electrostatic protection layer after ablation, and resulting in the clamping voltage. The size is difficult to control, and it is impossible to ensure that the electrostatic protection layer is made as thin as possible to obtain a higher clamping voltage. In serious cases, the electrostatic protection material cannot effectively protect the circuit or electronic components.

Method used

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  • Manufacturing method for printed circuit board and printed circuit board
  • Manufacturing method for printed circuit board and printed circuit board
  • Manufacturing method for printed circuit board and printed circuit board

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0054] A manufacturing method of a printed circuit board includes the following steps:

[0055] Step S1: forming a protective layer with an electrostatic protection layer in the middle and metal layers on both sides.

[0056] Specifically, forming a protective layer with an electrostatic protection layer in the middle and metal layers on both sides includes the following steps:

[0057] Step S11: prepare the first metal layer.

[0058] Such as Figure 2a As shown, the first metal layer 11 uses conductive copper foil, aluminum foil, or silver foil, etc., and copper foil is often used at present.

[0059] Step S12: Coating or printing an electrostatic protection material on the first metal layer, or pressing an electrostatic protection film formed of an electrostatic protection material on the first metal layer.

[0060] In this step, the electrostatic protection layer 12 in the middle of the protection layer can be formed in two ways, one of which is: Figure 2a As shown in the intermedia...

Embodiment 2

[0086] The difference between this embodiment and Embodiment 1 is that in the printed circuit board of this embodiment, the protective layer is a partially buried structure.

[0087] Specifically, in the manufacturing method of the printed wiring board, in the step of forming the protective layer in Embodiment 1, it further includes:

[0088] Step S14: cutting according to the size of the circuit to be electrostatically protected to obtain a protective layer suitable for the size of the circuit to be electrostatically protected. In this step, such as Image 6 As shown, the protective layer 1 can be divided by laser cutting, mechanical cutting or punching to form a plurality of smaller unit protective layers 15 for use. The unit protective layer 15 is only for the printed circuit board. Local circuits (including electronic components) are protected.

[0089] Among them, the area size of the unit protection layer 15 is determined by the size of the circuit to be electrostatically prot...

Embodiment 3

[0102] The difference between this embodiment and Embodiments 1 and 2 is that the printed circuit board in this embodiment has two or more protective layers, and the protective layer can be the same as that in Embodiment 1. The protective layer of the board for protection, such as Picture 10 , Picture 11 As shown; it can also be a protective layer that can protect a local printed circuit board as in Example 2, such as Picture 12 , Figure 13 Shown.

[0103] At the same time, it should be understood that in this embodiment, the via holes of each build-up layer in the printed circuit board are in the stacking direction, which is not necessarily required to be Figure 10-Figure 13 In the same way, the central axes of the through holes are all on the same vertical line. In the actual printed circuit board production process, as long as the via holes of each build-up layer can make the circuits and electronic components to be electrostatically protected in each build-up layer direc...

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Abstract

The invention relates to the technical field of the printed circuit boards and specifically relates to a manufacturing method for a printed circuit board and the printed circuit board. The manufacturing method for the printed circuit board includes: S1: forming a protective layer which contains an electrostatic protective layer at the middle part and metal layers at the two sides; S2: forming an adding layer at one side of the protective layer, wherein the adding layer is connected with a grounding element or a grounding layer; S3: arranging a via hole in the adding layer so that the via hole is connected with the metal layer of the protective layer, at the adding-layer side. S4: connecting the metal layer at the other side of the protective layer with a circuit to be electrostatic protected. The manufacturing method for the printed circuit board is capable of preventing damages of manufacturing processes such as laser and the like on the electrostatic protective layer so that a precise thickness of the electrostatic protective layer is ensured.

Description

Technical field [0001] The invention belongs to the technical field of printed circuit boards, and specifically relates to a manufacturing method of a printed circuit board and a printed circuit board thereof. Background technique [0002] In the printed circuit board industry, High Density Interconnect (HDI) circuits are increasingly becoming an indispensable component in the electronics industry. In a high-density interconnection circuit, if electrostatic discharge (ESD) occurs, it will cause the voltage on the circuit or electronic components to rise suddenly, which will affect the reliability of the printed circuit board, and even cause the printed circuit board be damaged. [0003] With the continuous emergence of new materials, special electrostatic protection materials have emerged, such as voltage switchable dielectric materials and resettable non-linear polymers. These materials have at least one of overvoltage and overcurrent protection and can protect Circuits (includi...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K1/02H05K1/11H05K3/00H05K3/42
Inventor 黄勇吴会兰
Owner NEW FOUNDER HLDG DEV LLC