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Thyristor

A thyristor and tube base technology, applied in the field of high-power thyristors, can solve problems such as increasing design difficulty and cost, increasing installation and operation difficulty, affecting heat dissipation effect, etc., and achieving the effect of light weight, good mechanical performance, and good heat dissipation effect.

Active Publication Date: 2014-01-01
ZHUZHOU CRRC TIMES SEMICON CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

Its disadvantages are: firstly, because the shape and flow channel of the radiator 6' in the prior art need to be matched with the thyristor 1', the design difficulty and cost are increased; secondly, the radiator 6' is generally not small and needs to be passed The method of pressing and fixing with the thyristor 1' not only increases the difficulty of installation and operation, but also makes the overall combination of the radiator 6' and the thyristor 1' larger; the third is that the connection between the radiator 6' and the radiator 1' is Connected together by pressure, there is a large contact thermal resistance, which affects the heat dissipation effect

Method used

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Embodiment Construction

[0025] The present invention will be further described below in conjunction with the accompanying drawings and specific embodiments.

[0026] The thyristor of the present invention includes a thyristor body 1 , and a heat dissipation flow channel 2 for cooling liquid to circulate and dissipate heat is arranged in the thyristor body 1 .

[0027] The thyristor body 1 includes a tube cover 1.1, a chip 1.2, an upper and lower molybdenum sheet 1.4 and a tube holder 1.3, and the tube cover 1.1, the upper molybdenum sheet, the chip 1.2, the lower molybdenum sheet and the tube holder 1.3 are sequentially connected; the heat dissipation flow channel 2 includes a first cooling channel 2.1 and a second cooling channel 2.2 respectively arranged in the tube cover 1.1 and the tube base 1.3. In the present invention, cooling water is used to dissipate heat, and the cooling water circulates through the first heat dissipation flow channel 2.1 and the second heat dissipation flow channel 2.2 to...

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Abstract

The invention discloses a thyristor which comprises a thyristor body (1). Heat dissipation flow paths (2) used for circulation of cooling liquid for heat dissipation are arranged in the thyristor body (1). The thyristor body (1) comprises a tube cap (1.1), a chip (1.2) and a tube base (1.3), wherein the tube cap (1.1), the chip (1.2) and the tube base (1.3) are connected in sequence. The heat dissipation flow paths (2) comprise the first heat dissipation flow path (2.1) and the second heat dissipation flow path (2.2), wherein the first heat dissipation flow path (2.1) is arranged in the tube cap (1.1), and the second heat dissipation flow path (2.2) is arranged in the tube base (1.3). The thyristor is small in size and capable of lowering thermal contact resistance, thereby enabling the heat dissipation effect to be better.

Description

technical field [0001] The invention relates to a thyristor, in particular to a high-power thyristor. Background technique [0002] As a switching element, thyristor can be used in high voltage and high current occasions. At present, high-power thyristors have been widely used in DC transmission, smart grid, power converters, non-contact switches and other fields, with broad prospects and huge development space. Since the thyristor itself has a certain voltage drop, there will be a certain loss when the current flows, and the greater the current, the greater the loss. When the thyristor chip produces loss, the temperature of the device will rise accordingly, and the temperature rise will have an adverse effect on the characteristics of the device. And when the temperature is higher than a certain value, the device will fail. Therefore, when the thyristor is used, it is a common and effective method to take away its heat through a radiator. [0003] There are many kinds o...

Claims

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Application Information

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IPC IPC(8): H01L23/473H01L23/367
Inventor 熊辉吴煜东颜骥谢腾飞孙文伟熊思宇郭金童唐豹
Owner ZHUZHOU CRRC TIMES SEMICON CO LTD
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