PGA/BGA (Pin Grid Array/Ball Grid Array) three-dimensional structure for assembling components and production method thereof

Abstract

The invention discloses a PGA/BGA (Pin Grid Array/Ball Grid Array) three-dimensional structure for assembling components. The PGA/BGA three-dimensional structure comprises a T/R module with a leading-out end which is in a BGA structure and a subsystem plate with a leading-out end which is in a PGA structure, wherein the T/R module comprises a T/R module base plate and a component connected to the T/R module base plate; the subsystem plate comprises a subsystem base plate and a component connected to the subsystem base plate; each of the T/R module base plate and the subsystem base plate is further provided with a cavity for mounting the component; the T/R module base plate and the subsystem base plate are LTCC (Low Temperature Co-Fired Ceramic) base plates. The PGA/BGA three-dimensional structure adopts the cavities and a BGA leading-out structure so as to realize the three-layered stereoscopic assembling of the components, reduce the assembling area, improve the assembling density and lighten the system weight. The cavity structures can protect the components well and the length of a lead wire is further optimized; the reliability of the T/R module is improved; the subsystem plate can be used for a plane mother plate and can also be used for assembling a curved-surface mother plate.

Description

technical field [0001] The invention relates to a PGA / BGA three-dimensional structure used for component assembly and a manufacturing method thereof. Background technique [0002] Active phased array antennas usually consist of hundreds or even thousands of T / R modules. These T / R modules are either arranged in a plane or arranged in a curved surface. Since the T / R module used for planar assembly cannot make good coplanar contact with the curved surface, it is difficult for the T / R module to perform coplanar welding with the curved surface during assembly. Therefore, T / R modules arranged in a plane are generally only suitable for assembly on a flat motherboard, and cannot be assembled on a curved motherboard. Similarly, since the T / R module used for curved surface assembly cannot make good coplanar contact with the flat motherboard, it is difficult for the subsystem to be welded with the plane, so the subsystems arranged on the curved surface are generally only suitable for...

AI Technical Summary

Problems solved by technology

Since the T/R module used for planar assembly cannot make good coplanar contact with the curved surface, it is difficult for the T/R module to perform coplanar welding with the curved surface during assembly

Therefore, T/R modules arranged in a plane are generally only suitable for flat motherboard assembly, and cannot be used for curved motherboard assembly

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