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Discrete type EMC packaged LED lead frame

A lead frame, discrete technology, used in electrical components, circuits, semiconductor devices, etc., can solve problems such as inapplicability and inability to meet production needs, and achieve the effects of low cost, small deformation, and guaranteed packaging quality.

Inactive Publication Date: 2014-01-01
NINGBO KANGQIANG ELECTRONICS CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In order to increase the productivity and efficiency of the LED lead frame, the copper alloy unit gap of the EMC lead frame is smaller, which can be integrated and applied. The traditional stamping process can no longer meet the production needs, and the etching process must be used for production. The high-density product arrangement enables The existing single-chip independent packaging technology is no longer applicable. It is necessary to use the overall integrated package, and then cut it into pieces according to the application requirements.

Method used

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  • Discrete type EMC packaged LED lead frame
  • Discrete type EMC packaged LED lead frame
  • Discrete type EMC packaged LED lead frame

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0019] figure 1 It is a schematic diagram of the structure of LED lead frame products in EMC packaging in the prior art. It can be seen from the figure that the product is a large package structure, and most of the middle parts are useless parts. Not only more epoxy resin is used, but also the produced The product cost is higher and the performance is relatively poor.

[0020] figure 2 , Figure 2-1 , Figure 3-1 — Figure 3-5 It is a schematic diagram of the product structure designed by the present invention, a discrete EMC-packaged LED lead frame, the lead frame includes a lead frame body, and is arranged in the solder leg area at the bottom of the body, and the lead frame also includes an epoxy resin encapsulation area 2. The cup bottom functional area 3 and the bottom heat dissipation area 4, the lead frame also includes a half-etched area 7, the half-etched area 7 is embedded in the epoxy resin encapsulation area 2, the surrounding area of ​​the LED lead frame, and...

Embodiment 2

[0022] see figure 2 , Figure 2-1 , Figure 3-1 — Figure 3-5 , as an improvement of the present invention, the half-etched region 7 is formed into a stepped shape by an etching process, and embedded in the epoxy resin encapsulation region 2 . The half-etched area 7 forms a stepped shape on the copper alloy through an etching process, and the half-etched area is embedded in epoxy resin after encapsulation to improve the bonding force between the copper alloy and the epoxy resin. The rest of the structures and advantages are exactly the same as in Embodiment 1.

Embodiment 3

[0024] see figure 2 , as an improvement of the present invention, the front and back sides of the lead frame are provided with intermediate flow channels 8 . The present invention separates the useless part in the middle into a small package, so that the two packages use the middle flow channel 8 to transmit the resin material from the front and back sides, which not only makes the overall deformation produced after the combination of epoxy resin and copper alloy Smaller, and there are runners on both sides, the amount of resin used for encapsulation of large areas is reduced, and the problem of bending deformation after encapsulation of large areas can be reduced. The rest of the structures and advantages are exactly the same as in Embodiment 1.

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Abstract

The invention relates to a discrete type EMC packaged LED lead frame which comprises a lead frame body and a welding foot area arranged on the lower portion of the lead frame body. The discrete type EMC packaged LED lead frame further comprises epoxy resin encapsulated areas, cup bottom functional areas and bottom radiating areas, and is characterized by further comprising half etched areas. The half etched areas are buried in the epoxy resin encapsulated areas, and the periphery of the LED lead frame, the unit connecting parts inside the lead frame and middle flow passes are provided with the half etched areas respectively. The discrete type EMC packaged LED lead frame has the advantages that the whole device is simple in structure and low in manufacturing cost; by means of the technical scheme, the inblock epoxy resin packaging of a lead frame in the prior art is changed into small-partition-block discrete type block packaging, the interval flow passes are the bidirectional flow passes in the front side and the back side, the flow paths wrap the two sides of the discrete type EMC packaged LED lead frame, therefore, the overall deformation of the packaged frame is smaller, the packaging quality can be guaranteed, and the reliability of the EMC product is improved.

Description

technical field [0001] The invention relates to a lead frame, in particular to a discrete EMC-packaged LED lead frame, that is, a semi-encapsulated EMC-packaged LED lead frame for loading light-emitting chips and translucent plastic packaging, which belongs to the field of packaging technology . Background technique [0002] Packaging technology is a technology of packaging integrated circuits with insulating plastic or ceramic materials. EMC-packaged LED lead frames are the basic materials for producing semiconductor light-emitting components. Generally, the base material of EMC-packaged LED lead frames is copper alloy. On the LED lead frame of the EMC package, the reflective cup and bowl are first made of a half-package with epoxy resin, and then the chip is loaded and wired at the bottom of the cup, and the chip is encapsulated with a transparent resin seal to form an integral semiconductor element. , and then use a knife to cut into individual LED products. In order t...

Claims

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Application Information

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IPC IPC(8): H01L33/62H01L33/54
CPCH01L33/62H01L33/54H01L33/64
Inventor 曹光伟李泓张继桉
Owner NINGBO KANGQIANG ELECTRONICS CO LTD