Pressure detection module and pressure sensor device having such a pressure detection module

一种检测模块、压力的技术，应用在测量装置、测量流体压力、通过电磁元件测量流体压力等方向，能够解决接触元件严密密封高、制造费事、大结构体积等问题，达到节省成本、小耗费、小结构空间的效果
CN103512701AActive Publication Date: 2014-01-15ROBERT BOSCH GMBH
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
ROBERT BOSCH GMBH
Publication Date
2014-01-15

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Abstract

The invention relates to a pressure detection module. The pressure detection module includes a receptacle part for receiving a carrier substrate. A first side of the carrier substrate is provided with a pressure detection unit; and the carrier substrate is inserted into the receptacle part by virtue of a second side facing away from the first side; and the carrier substrate is fixed on the bottom of a receptacle groove by virtue of the second side facing away from the first side. In order to construct the pressure detection module as small as possible, and to manufacture it in a cost-effective way, the receptacle part, the receptacle groove and a peripheral flange around the receptacle groove are, for example, provided with a plate-shaped design. The bottom has a contacting opening, through which contact surfaces of the carrier substrate, which are exposed at the contacting opening, are electrically contactable. Besides, the invention also relates to a pressure sensor device having such a pressure detection module.
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Description

technical field

[0001] The invention relates to a pressure detection module having the features stated in the preamble of the independent device claim and to a pressure sensor arrangement having a pressure detection module. Background technique

[0002] DE 102 28 000 A1 discloses a pressure sensor arrangement having a pressure detection module having the features of the preambles of the independent claims. The pressure sensor arrangement shown there is arranged in a housing and uses a pressure sensor, in particular a semiconductor pressure sensor, for detecting the pressure. The semiconductor pressure sensor has a sensor membrane which is provided with a sensor element on the upper side, wherein the central part is covered by the sensor membrane on the upper side. The pressure supply to the sensor membrane takes place here via grooves introduced into the rear side of the semiconductor pressure sensor, produced for example by reactive ion etching. Here, the semiconductor pr...

Claims

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