Microwave dielectric ceramic BaV2Nb2O11 capable of sintering at low temperature and preparation method thereof

Abstract

The invention discloses microwave dielectric ceramic BaV2Nb2O11 capable of sintering at a low temperature and a preparation method thereof. The microwave dielectric ceramic capable of being sintered at the low temperature has the composition of BaV2Nb2O11. The preparation method comprises the following steps: (1) weighing and batching original powder of BaCO3, V2O5 and Nb2O5 with the purity over 99.9 percent according to the chemical formula of the BaV2Nb2O11; (2) mixing the raw materials of the step (1) and performing wet milling for 12 hours, wherein the solvent is distilled water; pre-sintering for 6 hours in air atmosphere at 750 DEG C after the mixture is dried; (3) adding an adhesive into the prepared powder, granulating, pressing, forming, and sintering for 4 hours in the air atmosphere at the temperature between 810 and 840 DEG C, wherein the adhesive adopts a polyvinyl alcohol solution with the mass concentration of 5 percent, and the dosage of the polyvinyl alcohol solution accounts for 3 percent of the total mass of the powder. The ceramic prepared by the invention is sintered well between 810 and 840 DEG C, has the dielectric constant between 35 and 36, the Qf (quality factor) value of between 81,000 and 95,000 GHz, and low temperature coefficient of resonance frequency, can be co-fired with an Ag electrode, and has a great application value in industry.

Description

technical field [0001] The invention relates to a dielectric ceramic material, in particular to a microwave dielectric ceramic material for microwave components used at microwave frequencies, such as a dielectric substrate, a resonator, and a filter, and a preparation method thereof. Background technique [0002] Microwave dielectric ceramics refer to ceramics that are used as dielectric materials in circuits in the microwave frequency band (mainly UHF and SHF bands) and perform one or more functions. They are widely used as resonators, filters, and dielectric substrates in modern communications. Components such as chips and dielectric waveguide circuits are the key basic materials of modern communication technology. They have been used in portable mobile phones, car phones, cordless phones, TV satellite receivers and military radars. They are used in modern communication tools. It is playing an increasingly important role in the process of miniaturization and integration. ...

AI Technical Summary

Problems solved by technology

In recent years, with the development of low temperature co-fired ceramics (Low Temperature Co-fired Ceramics, LTCC) and the requirements of the development of microwave multilayer devices, researchers at home and abroad have carried out extensive exploration and research on some low-temperature co-fired materials, mainly The glass-ceramic or glass-ceramic composite material system is used. Because the low melting point glass phase has relatively high dielectric loss, the existence of the glass phase greatly improves the dielectric loss of the material.

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