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Air-floating roller bed type thermal treatment furnace for semiconductor devices

A heat treatment furnace, semiconductor technology, applied in the direction of furnace, furnace type, furnace components, etc., can solve the problem that the atmosphere and environment in the furnace cannot be fundamentally improved, and achieve the effect of consistent force, consistent friction, and prevention of deviation

Active Publication Date: 2014-02-05
BEIJING SOLARRAY TECHNOIOGY CO LTD +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The patent CN1936474A describes a dust-proof device in a roller hearth heat treatment furnace. On the side wall of the furnace body, above the perforation of the roller tube, a clean air duct with an opening is installed to prevent the furnace body from falling outside. The dust in the furnace enters the furnace body. The clean gas introduced in this patent only plays a protective role in preventing external dust from entering the furnace on both sides of the furnace body, and cannot fundamentally improve the atmosphere and environment in the furnace.

Method used

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  • Air-floating roller bed type thermal treatment furnace for semiconductor devices
  • Air-floating roller bed type thermal treatment furnace for semiconductor devices
  • Air-floating roller bed type thermal treatment furnace for semiconductor devices

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Embodiment Construction

[0022] The present invention will be further described in detail below in conjunction with the accompanying drawings and embodiments.

[0023] Such as figure 1 As shown, the present invention discloses an air flotation roller type semiconductor device heat treatment furnace, which is composed of basic units such as an upper furnace body 1, a lower furnace body 2, a transmission roller shaft 3, a heating lamp tube 5, and a cooling fan 6. figure 2 The structure of its vented hollow roller shaft 302 is disclosed. As shown in the figure, the roller table for transporting semiconductor devices 4 is composed of several horizontally arranged rollers 3 that can reciprocate along their own axes. The rollers in the furnace are hollow rollers 302, on which the semiconductor devices 4 There are several ventilation holes 303 along the radial direction at the passing position, and a ventilation shaft head 304 is installed at one end of the hollow roller shaft 302. Clean compressed air or...

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Abstract

The invention relates to an air-floating roller bed type thermal treatment furnace for semiconductor devices. The heat-treatment furnace is characterized in that a roller bed for transferring the semiconductor devices comprises a plurality of horizontally-arranged roll shafts capable of reciprocating along self axial lines, at least part of the roll shafts are hollow, a plurality of breathing holes are formed in the parts, where the semiconductor devices pass, of the hollow roll shafts in the radial direction, at least one end of each hollow roll shaft is connected with one air inlet pipe through a rotary joint, and air enters furnace chamber parts where the semiconductor devices pass through the breathing holes in the hollow roll shafts. According to the thermal treatment furnace provided by the invention, the atmosphere and the cleanliness of a center diffusion zone in the furnace are fundamentally ensured, so that the diffusion effect and the quality are improved.

Description

technical field [0001] The invention relates to an air flotation roller type semiconductor device heat treatment furnace, which can be used for sintering heat treatment or diffusion heat treatment of semiconductor devices such as solar cells. Background technique [0002] In the entire production process of solar cells, the three processes of diffusion, printing and sintering are the most important. Among them, the sintering process is mainly used to dry the paste printed on the surface of the silicon wafer, burn off the organic solvent volatilized from the paste, and simultaneously sinter the front and back sides of the silicon wafer of the solar cell to make the paste printed on the silicon wafer The metal electrode forms a good ohmic contact with the silicon wafer, and the quality of sintering directly affects the conversion efficiency of the solar cell. [0003] Usually, the front side of the sintered battery sheet is printed with silver paste, and the back side is prin...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): F27B9/30F27D5/00
Inventor 袁向东许颖袁瑒
Owner BEIJING SOLARRAY TECHNOIOGY CO LTD
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