A kind of automobile rectification chip and its rectification substrate preparation method
A rectifier chip and base material technology, applied in manufacturing tools, welding equipment, laser welding equipment, etc., can solve the problems of poor reverse surge current resistance, poor thermal fatigue resistance, poor reliability, etc., to improve the resistance The ability of reverse current, the effective welding area is large, and the effect of improving the ability of passing current
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[0036] The present invention also provides a method for preparing a rectifying substrate, comprising the steps of:
[0037] S1. A wafer is provided, and a plurality of circular cutting patterns are formed on the wafer;
[0038] S2. Etching the edge line of the circular cutting pattern to form a circular groove on the wafer;
[0039] S3. Using a laser dicing machine to cut along the circular groove to obtain multiple circular silicon wafers;
[0040] S4. Form a circular first mesa and a circular second mesa on the circular silicon wafer, the first mesa is higher than the second mesa, and the second mesa surrounds the first mesa The countertops, finally get rectified substrates.
[0041] The automobile rectification chip and its rectification base material preparation method provided by the present invention, the automobile rectification chip comprises a rectification base material, and said rectification base material comprises a first mesa and a second mesa, and said first m...
Embodiment 1
[0048] This embodiment provides an automotive rectifier chip, combined with image 3 with Figure 4 as shown, image 3 It is a top view of an automobile rectifier chip provided in this embodiment, Figure 4 for image 3 The cutaway view of the automotive rectifier chip shown along the direction AA'. The automotive rectifier chip includes: a rectifier substrate 31 , a first metal layer 32 , a second metal layer 33 , a semi-insulating polysilicon film 34 , a glass passivation layer 35 and an insulating layer 36 .
[0049] The first mesa 311 and the second mesa 312 of the rectifying substrate 31, the first mesa 311 is higher than the second mesa 312, and the second mesa 312 surrounds the first mesa 311, the first The mesa 311 is circular, the second mesa 312 is circular, and the part from the plane where the second mesa 312 is located to the bottom surface of the rectifying substrate 1 is cylindrical (ie figure 2 The part below the dotted line). The side surfaces 313 of th...
Embodiment 2
[0056] This embodiment provides a method for preparing a circular rectifying substrate, referring to Figure 5 As shown, it is a flowchart of a method for preparing a circular rectifying substrate provided in the embodiment of the present application, including steps:
[0057] S1. A wafer is provided, and a plurality of circular cutting patterns are formed on the wafer.
[0058] Provide a cleaned and diffused wafer, coat photoresist on the surface of the wafer, design a plurality of circular cutting patterns on the photoresist, and then cut the edges of the circular cutting patterns line exposure and development to form a plurality of circular cutting patterns on the wafer.
[0059] Use SC450 negative photoresist, through the uniform layer (1200RPM, 10S), exposure (15mW / cm 2 , 15S), developing (automatic developing machine operation), baking (140 degrees Celsius, 30min), forming multiple circular cutting patterns on the wafer, forming multiple circular cutting patterns on th...
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Abstract
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