Cooling device manufacturing method, cooling device and lighting device

A lighting device and heat dissipation device technology, which is applied in the direction of lighting devices, cooling/heating devices of lighting devices, lighting and heating equipment, etc., can solve the problems of fragile ceramic materials, damage to heat sinks, and reduce the heat dissipation performance of heat sinks, etc., to achieve Long life and high light efficiency

Inactive Publication Date: 2014-02-12
OSRAM GMBH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, there may be gaps in the material of the cast heat sink, which greatly increases the thermal resistance of the heat sink and reduces the heat dissipation performance of the heat sink
The cost of the ceramic radiator is too high, and at the same time, due to the fragile characteristics of the ceramic material, it is easy to cause damage to the radiator

Method used

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  • Cooling device manufacturing method, cooling device and lighting device
  • Cooling device manufacturing method, cooling device and lighting device
  • Cooling device manufacturing method, cooling device and lighting device

Examples

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Embodiment Construction

[0025] figure 1 A schematic diagram of a heat dissipation device 100 according to the present invention is shown. It can be seen from the figure that the heat dissipation device 100 according to the present invention includes a base 1 and a plurality of heat sinks 2 arranged on the base 1 . In the method according to the invention, firstly in step a) a base body 1 made of metal by a forging process is provided, then in step b) at least one cooling element 2 is provided which is made of metal by a casting process or by forging process, and finally fix the heat sink 2 to the base 1 in step c. Since the base body 1 is made by a forging process, the base body 1 is usually in the shape of a plate, and the plate-shaped base body 1 has a very simple outline, which is very easy to be processed by a forging process. At the same time, the plate-shaped base 1 can be more closely in thermal contact with the circuit board as the heat source, thereby maximally increasing the contact area ...

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Abstract

The invention relates to a cooling device (100) manufacturing method. The method includes the steps: a) providing a base (1) made of metal by the aid of a forging process; b) providing at least one cooling part (2); c) fixing the cooling parts (2) to the base (1). In addition, the invention further relates to a cooling device (100) manufactured by the method and a lighting device (200) with the cooling device (100).

Description

technical field [0001] The invention relates to a method of manufacturing a heat sink. In addition, the present invention also relates to a heat dissipation device manufactured by the above method and an illuminating device with the heat dissipation device. Background technique [0002] LED replacement lamps such as types like MR16, PAR38, A60 and GX53 are increasingly replacing traditional lighting fixtures such as incandescent and fluorescent lamps. This is because replacement lamps of this type are more energy efficient, smaller in size and have a longer life. With the development of technology, the LED package itself can achieve higher efficiency, for example, it can obtain 140lm / W cool white light and 90lm / W warm white light, and its life span can reach 50,000 hours. But when LEDs are integrated into replacement lamps along with LED drivers, thermal management devices, and optics, the efficiency and lifetime of the replacement lamps are highly dependent on how the dri...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): F21V29/00F21S2/00F21Y101/02F21K9/20F21K9/90F21V29/70F21V29/89F21Y115/10
Inventor 迪尔克·布赫豪斯尔林晶胡瑾张宏伟潘耿俊兰挺彪
Owner OSRAM GMBH
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