Laminated ceramic electronic component and method of fabricating the same

Abstract

There is provided a laminated ceramic electronic component, including a ceramic body including a dielectric layer; and first and second internal electrodes disposed to face each other, having the dielectric layer interposed therebetween within the ceramic body, wherein when a value of 1% is set to be D1, a value of 50% is set to be D50, and a value of 99% is set to be D99 in a cumulative distribution of dielectric grains by an average particle diameter thereof within the dielectric layer, 2@D99 / D50@3 and 2@D50 / D1@3 are satisfied. A high-capacity laminated ceramic electronic component may be implemented with improved adhesion between the dielectric layer and the internal electrode, and improved withstand voltage characteristics and excellent reliability may be implemented.

Description

[0001] Cross References to Related Applications [0002] This application claims priority to Korean Patent Application No. 10-2012-0079527 filed Jul. 20, 2012 at the Korean Intellectual Property Office, the entire contents of which are hereby incorporated by reference herein Application. technical field [0003] The present invention relates to a high-capacitance laminated ceramic electronic component having improved withstand voltage characteristics and excellent reliability. Background technique [0004] Recently, as electronic products have been miniaturized, demands for small, high-capacitance laminated ceramic electronic components have increased. [0005] Therefore, thinning and lamination of dielectrics and internal electrodes have been attempted by various methods. Currently, laminated ceramic electronic components having thinned dielectric layers and laminates with an increased number of layers have been manufactured. [0006] In addition, in order to achieve thi...

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Problems solved by technology

[0007] In this case, the surface roughness of the dielectric layer can be gradually reduced, but the adhesion between the dielectric layer and the internal electrodes will also decrease accordingly

[0008] In this way, in the manufacturing process of laminated ceramic electronic components, it will cause delamination of dielectric layers and internal electrodes, which will reduce the reliability of laminated ceramic electronic components

[0009] Also, using only fine ceramic powder particles may lower the dielectric constant

[0010] On the other hand, when the ceramic powder used has relatively large particles, as the surface roughness of the dielectric layer increases, the withstand voltage characteristics may be reduced

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