Light-emitting diode structure and method for manufacturing the same

A technology for light-emitting diodes and a manufacturing method, which is applied in semiconductor/solid-state device manufacturing, semiconductor/solid-state device components, semiconductor devices, etc., and can solve problems such as disconnection of interconnect layers

Inactive Publication Date: 2014-02-12
CHI MEI LIGHTING TECH +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Therefore, the conductive material does not need to be filled in the isolation trench between two adjacent LED chips, thus solving the problem of disconnection in the interconnection layer.

Method used

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  • Light-emitting diode structure and method for manufacturing the same
  • Light-emitting diode structure and method for manufacturing the same
  • Light-emitting diode structure and method for manufacturing the same

Examples

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Embodiment Construction

[0070] Please refer to figure 2 , Figure 3A and Figure 4 ,in figure 2 is a top view illustrating a light emitting diode structure according to an embodiment of the present invention, Figure 3A is drawn along figure 2 The cross-sectional view of the light-emitting diode structure obtained by the AA' section line, Figure 4 is drawn along figure 2 The cross-sectional view of the LED structure obtained by the BB' section line. In this embodiment, the light emitting diode structure 200 may be a high voltage light emitting diode (High Voltage LED; HV LED).

[0071] The LED structure 200 is formed by connecting several LED chips 228 in series. exist figure 2 In the illustrated embodiment, the LED structure 200 is formed by serially connecting 12 LED chips 228 arranged in an array. Isolation trenches 216 and 240 are provided around each LED chip 228 to electrically isolate these LED chips 228 . In addition, two adjacent LED chips 228 are electrically connected throu...

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PUM

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Abstract

A light-emitting diode (LED) structure and a method for manufacturing the same. The LED structure includes an insulation substrate, a plurality of LED chips and a plurality of interconnection layers. Each LED chip includes an epitaxial layer and a dielectric layer stacked on a surface of the insulation substrate in sequence. Each LED chip is formed with a first conductivity type contact hole and a second conductivity type contact hole penetrating the dielectric layer, and a first isolation trench disposed in the epitaxial layer and between the second conductivity type contact hole of the LED chip and the first conductivity type contact hole of the neighboring LED chip. Each interconnection layer extends from the second conductivity type contact hole of each LED chip to the first conductivity type contact hole of the neighboring LED chip by passing over the first isolation trench to electrically connect the LED chips.

Description

technical field [0001] The present invention relates to a light emitting structure, and in particular to a light emitting diode (LED) structure and a manufacturing method thereof. Background technique [0002] Please refer to figure 1 , which shows a partial cross-sectional view of a conventional LED structure connected in series. The conventional series-connected LED structure 100 includes a plurality of series-connected LED chips, such as LED chips 106 a and 106 b , disposed on the surface 104 of an insulating substrate 102 . Two adjacent LED chips 106 a and 106 b are separated by an isolation trench 122 . Each LED chip 106a and 106b includes an undoped semiconductor layer 108, a first electrical type semiconductor layer 110, an active layer 112, a second electrical type semiconductor layer 114 and a transparent conductive layer stacked on the surface of the insulating substrate 102 in sequence. Layer 116. [0003] Each LED chip 106 a and 106 b has a mesa structure 128...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L23/485H01L27/15H01L21/762H01L21/60
CPCH01L33/08H01L27/153H01L33/382H01L33/62H01L2924/0002H01L2924/00
Inventor 朱长信李学麟徐智魁陈源泽吴浩青
Owner CHI MEI LIGHTING TECH
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