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Wave-spring processing system and processing method

A wave spring and processing system technology, applied in the field of spring manufacturing, can solve the problems of unreasonable wave spring process arrangement, non-correspondence between wave peaks and wave troughs, and insufficient closeness between layers, so as to save equipment costs and low manufacturing costs , the effect of high pass rate

Inactive Publication Date: 2014-02-19
英科控股有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

At present, the processing method of the wave spring is to wind the wire into a flat circle, and use a special forming mold to process it, but the processed product has out-of-round phenomenon; The phenomenon of looseness and deformation between layers is not close enough, resulting in a decrease in the pass rate, which further leads to a decrease in production efficiency.
And in the prior art, the wave spring processing method also has technical problems such as unreasonable process arrangement and cumbersome operation.

Method used

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  • Wave-spring processing system and processing method

Examples

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Embodiment Construction

[0025] like figure 1 As shown, the wave spring processing system includes a frame 1, and a static mold 2 and a movable mold 3 opposite to each other are arranged on the frame 1. The static mold 2 is fixed on the frame 1, and the movable mold 3 is connected with a drive The movable mold 3 and the static mold 2 are interlocked or separated from each other by a drive mechanism 4. The static mold 2 is tile-shaped and a static tile block 21 is provided inside the static mold 2. The end of the static tile block 21 has a wavy shape. The static molding surface 211 of the movable mold 3 is tile-shaped and a movable tile block 31 is provided on the inner side of the movable mold 3. There is a wavy dynamic molding surface 311 at the end of the movable tile block 31. The static molding surface 211 and the dynamic molding surface The molding surface 311 is opposite and the static molding surface 211 coincides with the dynamic molding surface 311 when the movable mold 3 is fastened with the...

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Abstract

The invention belongs to the technical field of spring manufacturing, and relates to wave springs, in particular to a wave-spring processing system and a processing method. A fixed die is tile-shaped with the inner side provided with a fixed tile-shaped block, a fixed wave-shaped forming surface is arranged at the end portion of the fixed tile-shaped block, a moving die is tile-shaped with the inner side provided with a moving tile-typed block, a moving wave-shaped forming surface is arranged on the end portion of the moving tile-shaped block, and opposite positions of the fixed forming surface and the moving forming surface as well as the fixed forming surface and the moving forming surface are matched with each other when the moving die and the fixed die are fastened. Compared with the prior art, the wave-spring processing system and the processing method have the advantages of being reasonable in design, simple in structure, high in acceptability, low in manufacturing cost, environmentally friendly, applicable to production of products different in specifications, satisfactory to demands of enterprises, economical in equipment cost of the enterprises, easy to demount, convenient to maintain, simple to operate and convenient to process.

Description

technical field [0001] The invention belongs to the technical field of spring manufacturing, and relates to wave springs, in particular to a wave spring processing system and processing method. Background technique [0002] Wave spring is an elastic element with several peaks and valleys on a ring-shaped metal. It has high requirements for size and elastic precision, and can be used in military, petrochemical, steel, metallurgy, shipbuilding and other hydraulic valve industries. At present, the processing method of the wave spring is to wind the wire into a flat circle, and use a special forming mold to process it, but the processed product has out-of-round phenomenon; The phenomenon of looseness and deformation between layers is not tight enough, resulting in a reduction in the pass rate, which further leads to a reduction in production efficiency. And in the prior art, the processing method of the wave spring also has technical problems such as unreasonable process arrang...

Claims

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Application Information

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IPC IPC(8): B21F35/00
Inventor 楼生江
Owner 英科控股有限公司
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