Machine bench performance matching method and system of semiconductor manufacturing equipment

Abstract

The invention discloses a machine bench performance matching method and system of semiconductor manufacturing equipment. The system comprises a plurality of processing machine benches, a fault detection and classification system, a product quality tester and a data collecting engine and processing system. The processing machine benches execute a same product manufacturing technology and machine products of a same specification. The fault detection and classification system monitors production processes of all the processing machine benches in the technology process. All monitored process variable data are provided for the data collecting engine and processing system. The product quality tester tests quality of the machined products in the technology process in a sampling mode and provides quality data for the data collecting engine and processing system. Through performance matching of the processing machine benches in the same technology process, key process variables of the machine benches affecting and leading poor quality are rapidly found, and a parameter adjustment scheme is provided for a field engineer in the process of maintaining the machine benches, so that the products manufactured by the different machine benches almost are the same in quality.

Description

technical field [0001] The invention relates to a performance matching method and system of different processing machines in the same technological process in the semiconductor manufacturing process, which is suitable for product quality control in semiconductor manufacturing processes such as wafers / TFT-LCD, and belongs to the field of process control. Background technique [0002] The primary challenge facing the semiconductor manufacturing industry is the need to continuously improve the quality of the end product, which is affected by the variability in many process steps. In order to reduce the variability of the process and improve product quality, high-efficiency processing machines are constantly being developed. However, from the perspective of economic costs, the production enterprises may not necessarily eliminate the old machines, so different models of machines will have different Efficiency and results, even the same type of processing machine, the quality of t...

AI Technical Summary

Problems solved by technology

This method can effectively reduce unqualified products, but it cannot guarantee the consistency of manufactured product quality; secondly, SPC only monitors the process variables of a single processing machine, and does not learn from parallel machines in the same batch and the same process flow. In addition, not all failures in SPC are related to the final quality of the product. In other words, abnormal process variables detected by SPC do not mean that there is an abnormality in product quality control

Even if the on-site engineer finds that the manufacturing performance of a certain processing machine has deteriorated through SPC, but does not know the specific reason, it needs to compare the design drawings of the machine for item-by-item comparison, which leads to low maintenance efficiency and high maintenance costs

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