Automatic lossless dismounting recovery method and automatic lossless dismounting recovery device of discarded printed circuit board

Abstract

The invention discloses an automatic lossless dismounting recovery method and an automatic lossless dismounting recovery device of a discarded printed circuit board. The method is characterized by comprising the following steps of preparing low-grade overheat vapor by using industrial waste heat through a waste heat boiler, and heating and pulse blowing the discarded printed circuit board at high temperature so as to realize the automatic lossless dismounting of electronic elements and devices on the discarded printed circuit board; guiding the overheat vapor after the working into a heat exchanger, reheating the overheat vapor after the working through the heat exchanger by utilizing the industrial waste heat as a heat source, and recycling the overheat vapor. By adopting the automatic lossless dismounting recovery method and the device, not only can the energy be greatly saved, but also the heat pollution caused by the industrial waste heat can be effectively reduced, the secondary pollution to the environment caused by dismounting the discarded printed circuit board at the high temperature can be avoided, the energy can be reasonably reused, and not only can the national policy of energy conservation and emission reduction be satisfied, but also a positive effect on protecting the environment can be realized.

Description

technical field [0001] The invention relates to the technical field of comprehensive utilization of electronic waste resources, in particular to a method and equipment for automatic non-destructive disassembly and recycling of waste printed circuit boards Background technique [0002] With the development of science and technology, especially the rapid development of high-tech, the speed of electronic product replacement is accelerating. As an indispensable part of electronic products, the amount of discarded circuit boards is increasing day by day. According to statistics, the world's electronic waste is growing at a rate of 18%, becoming the fastest growing waste. Data show that the current e-waste generated in Europe is 6-8 million tons, and the e-waste in the United States accounts for 2%-5% of the total waste in the United States. In my country, since 2004, at least 5 million computers, 5 million TV sets, 50 million mobile phones, 5 million washing machines, and 4 mill...

AI Technical Summary

Problems solved by technology

In the prior art, the main disadvantage of using double-layer sealing flap valves at the feed inlet and outlet is that under high temperature and high pressure conditions, the double-layer sealing flap valves cannot be completely sealed, which increases the risk of low-grade superheated steam. The loss and cost increase; and the excessive leakage of low-grade steam during the operation of the equipment will deteriorate the working environment, cause thermal pollution, and endanger human health

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