Acidic etching liquid

Abstract

The invention discloses application of a compound used as a catalyst in preparing an acidic etching liquid which does not generate chlorine. The compound has a complexation effect on monovalent or bivalent copper ions in the acidic etching liquid or can generate a stable complex. According to the Nernst equation, the redox potential of the monovalent copper ions converted to the bivalent copper ions after complexation or coordination is reduced till the redox potential is less than the reduction potential of oxygen in aqueous liquor, so that balance of a reaction A can be further smoothly carried out toward a direction of generating the bivalent copper ions even in an acidic high chlorine environment, wherein the reaction A is as shown in the specification.

Description

[0001] related application [0002] This application is a divisional application with the filing date of the invention patent being March 4, 2011, the application number being 201110053012.7, and the title of the invention being "An Acidic Etching Solution That Does Not Generate Chlorine Gas and Its Catalyst". technical field [0003] The invention is used in the acidic copper chloride etching process used for high-precision and high-density line etching in the printed circuit board manufacturing industry, and specifically relates to an acid etching solution that does not generate chlorine gas and a catalyst thereof. Background technique [0004] At present, the electronic industry is developing rapidly. As a printed circuit board carrying electronic products, it must also develop in the direction of making more precise circuit graphics. The thinnest precision circuit has reached the level of 25μm wire diameter and 25μm spacing. In its manufacturing process, etching is an in...

AI Technical Summary

Problems solved by technology

[0040] The purpose of adding etching inhibitors is to achieve a high etching coefficient by forming a loose insoluble film, which will lead to a very slow etching rate, which is not only unacceptable for modern industries pursuing production efficiency, but also means that the dry film of corrosion resistance Or the ink needs to withstand a longer attack, which is not good for masking etching, and the more critical two methods have not solved the problem of chlorine gas overflow

[0041] At the same time, the method of maintaining the content of divalent copper ions by adding an oxidant will cause the oxidant to be continuously absorbed by chloride ions (Cl - ) is consumed by releasing chlorine gas, and divalent copper ions (Cu 2+ ) Local overconcentration, it is difficult to maintain a fast etching rate, and the oxidant needs to be continuously consumed during the etching process, which increases the cost of raw materials and the cost of the automatic addition system for controlling oxidant injection

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