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induction cooker

A technology of induction cooker and electrical components, which is applied in the field of induction cooker, can solve the problems of poor heat dissipation of electrical components, achieve the effects of prolonging the service life, prolonging the overall life, and improving heat dissipation conditions

Active Publication Date: 2016-06-29
MIDEA GRP CO LTD +1
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The heat conduction plate of the electromagnetic oven provided by the present invention directly transfers the heat generated by multiple electrical components to the radiator, and cools the radiator through the fan. This heat dissipation method can effectively solve the heat dissipation effect of some electrical components caused by the different air volumes at the positions of the electrical components. The bad problem is to improve the heat dissipation conditions of the electrical components in the poor heat dissipation area on the main control board, so that each electrical component can be effectively dissipated, prolong the service life of the electrical components, and prolong the life of the main control board. overall life

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Embodiment Construction

[0021] In order to understand the above-mentioned purpose, features and advantages of the present invention more clearly, the present invention will be further described in detail below in conjunction with the accompanying drawings and specific embodiments. It should be noted that, in the case of no conflict, the embodiments of the present application and the features in the embodiments can be combined with each other.

[0022] In the following description, many specific details are set forth in order to fully understand the present invention. However, the present invention can also be implemented in other ways different from those described here. Therefore, the protection scope of the present invention is not limited by the specific details disclosed below. EXAMPLE LIMITATIONS.

[0023] Refer below figure 1 and figure 2 An induction cooker according to some embodiments of the invention is described.

[0024] Such as figure 1 As shown, the induction cooker includes: an up...

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Abstract

The invention provides an induction cooker, comprising: an upper cover, a bottom plate, a main control board, a coil disk, a fan, a heat sink and a heat conduction plate, the heat conduction plate is respectively connected with the electrical components and the heat sink, and absorbs the heat generated by the electrical components, and transfer the heat to the heat sink. The heat conduction plate of the induction cooker provided by the present invention directly transfers the heat generated by multiple electrical components to the radiator, and cools the radiator through a fan. This heat dissipation method can effectively solve the heat dissipation effect of some electrical components caused by the different air volumes at the positions of the electrical components. The bad problem is to improve the heat dissipation conditions of the electrical components in the poor heat dissipation area on the main control board, so that each electrical component can be effectively dissipated, prolong the service life of the electrical components, and prolong the life of the main control board. overall lifespan.

Description

technical field [0001] The invention relates to a household appliance, in particular to an electromagnetic cooker. Background technique [0002] Due to the advantages of energy saving, cleanliness, and fast heating speed, induction cookers are becoming more and more common in daily life; the existing heat dissipation method of induction cookers is that the IGBT and the bridge stack are connected to the radiator, and the fan directly blows the radiator and the capacitors, chips, etc. on the main control board. Choke coils, transformers and other electrical components that can generate heat, but the effect of this cooling method depends on the size of the air volume where the electrical components are located. Due to the differences in the structural size and location of each electrical component, some electrical components The heat dissipation effect is poor, thereby reducing the service life of electrical components. Contents of the invention [0003] In order to solve at...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): F24C7/00F24C15/00H05K7/20
Inventor 罗绍生陈光亮邹伟
Owner MIDEA GRP CO LTD
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