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Blind hole machining method

A processing method and blind hole technology are applied in the secondary treatment of printed circuits and the improvement of the metal adhesion of insulating substrates. Improved quality, smooth bottom, and simple steps

Inactive Publication Date: 2014-02-26
吴冬梅
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] Since the inside of the blind hole is not connected, there will be problems that the inside and the bottom are not smooth or cannot meet the processing requirements during processing.

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0014] A method for processing a blind hole, comprising the steps of:

[0015] The first step is to determine the size of the circle according to the size of the blind hole, use the laser machine to determine the position of the center of the circle on the material, and at the same time determine the length and distance between the laser head of the laser machine and the plastic.

[0016] The second step is to adjust the laser spot size on the material so that the spot radius is equal to the size of the blind hole. The laser machine is used to process the preliminary hole of the straight section of the blind hole.

[0017] The third step is to use a broach to draw a straight section in the preliminary hole.

[0018] The fourth step is to use a milling cutter to make the conical part at the bottom of the blind hole, and then use a reamer to ream the edge with a tolerance of 1 mm.

Embodiment 2

[0020] A method for processing a blind hole, comprising the steps of:

[0021] The first step is to determine the size of the circle according to the size of the blind hole, use the laser machine to determine the position of the center of the circle on the material, and at the same time determine the length and distance between the laser head of the laser machine and the plastic.

[0022] The second step is to adjust the laser spot size on the material so that the spot radius is equal to the size of the blind hole. The laser machine is used to process the preliminary hole of the straight section of the blind hole.

[0023] The third step is to use a broach to draw a straight section in the preliminary hole.

[0024] The fourth step is to use a milling cutter to make the conical part at the bottom of the blind hole, and then use a reamer to ream the edge with a tolerance of 3 mm.

Embodiment 3

[0026] A method for processing a blind hole, comprising the steps of:

[0027] The first step is to determine the size of the circle according to the size of the blind hole, use the laser machine to determine the position of the center of the circle on the material, and at the same time determine the length and distance between the laser head of the laser machine and the plastic.

[0028] The second step is to adjust the laser spot size on the material so that the spot radius is equal to the size of the blind hole. The laser machine is used to process the preliminary hole of the straight section of the blind hole.

[0029] The third step is to use a broach to draw a straight section in the preliminary hole.

[0030] The fourth step is to use a milling cutter to make the conical part at the bottom of the blind hole, and then use a reamer to ream the edge with a tolerance of 2 mm.

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Abstract

The invention discloses a blind hole machining method. The blind hole machining method includes the following steps that the size of a circle is determined according to the size of a blind hole, the position of the center of the circle is determined on a material with a laser machine, and meanwhile the length distance between a laser head of the laser machine and plastics is determined; the size of a light spot on the material by a laser is adjusted to enable the radius of the light spot to be equal to the size of the blind hole; machining is performed by the laser machine, and a preliminary hole of a straight segment of the blind hole is machined; a broach is used, and the straight segment is drawn in the preliminary hole; a milling cutter is used for machining a conical portion of the bottom of the blind hole, a reamer is used for reaming edges, and the tolerance is 1-3mm. According to the blind hole machining method, the steps for machining the blind hole are simple, the quality of the blind hole is good, the bottom is smooth, in addition, the requirement for the tolerance can be met, and the quality of the blind hole is improved.

Description

technical field [0001] The invention belongs to the field of mechanical processing, in particular to a blind hole processing method. Background technique [0002] One side of the blind hole is on the surface of the board, and then leads to the inside of the board. Blind hole It is a via hole that connects the surface layer and the inner layer without going through the entire board. [0003] Since the inside of the blind hole is not connected, there will be problems during processing that the inside and the bottom are not smooth or cannot meet the processing requirements. Contents of the invention [0004] The object of the present invention is to provide a blind hole processing method, the blind hole processed by the method is smooth inside and bottom, and the quality of the blind hole is improved. [0005] The technical solutions adopted are: [0006] A method for processing a blind hole, comprising the steps of: [0007] The first step is to determine the size of the...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K3/38
Inventor 吴冬梅
Owner 吴冬梅
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