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High-frequency module

一种高频模块、开关模块的技术，应用在电气元件、天线接地开关结构联结、特定的阵列进料系统等方向，能够解决多层基板大型化等问题

Active Publication Date: 2014-03-05
MURATA MFG CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In this case, if many circuit components are mounted on the multilayer substrate, the multilayer substrate will be enlarged

Method used

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Embodiment Construction

[0032] Hereinafter, preferred embodiments of the high-frequency module according to the present invention will be described with reference to the accompanying drawings. In the embodiments described below, a high-frequency module that transmits and receives communication signals such as a GSM (registered trademark) (Global System for Mobile Communications: Global System for Mobile Communications) 850 communication signal, a GSM 900 communication signal will be described. Communication signal, communication signal of GSM1800, communication signal of GSM1900, frequency band class Band1 (band 2GHz), Band2 (band 1GHz), Band5 (band 800MHz) of W-CDMA (Wideband Code Division Multiple Access) communication system ), Band8 (band 900MHz).

[0033] figure 2 It is a schematic diagram which shows the structure of the switching circuit used for the high frequency module which concerns on embodiment. image 3 It is a schematic diagram which shows the circuit structure of the high frequency...

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Abstract

This high-frequency module has port electrodes (PMan1, PMrH1, PMrH2, PMtH, PMc1, PMc2) which serve as external connection terminals provided on a laminated body of dielectric layers. Port electrode (PMan1) is connected to an antenna (ANT1). Port electrodes (PMrH1, PMrH2, PMtH, PMc1, PMc2) are respectively connected to communication systems having corresponding frequency bands. Port electrode (PMan1) is connected, by means of switch elements (SW1-SW5), to port electrodes (PMrH1, PMrH2, PMtH, PMc1, PMc2). Switch elements (SW1, SW2) and switch elements (SW3-SW5) are unconnected with each other inside a switch circuit (SWIC), and the switch elements can be connected by means of a common terminal (S1) provided outside the switch circuit (SWIC). Thus, the resulting high-frequency module can accommodate a design change using the same switch circuit without modifying the switch circuit.

Description

technical field [0001] The present invention relates to a high-frequency module capable of communicating in a plurality of frequency bands using a common antenna, for example, in multi-band communication. Background technique [0002] In recent information communication devices such as cellular phones, many have a function capable of utilizing a plurality of frequencies (multi-band) with one device. In a communication device having the above-described function, in order to cope with a plurality of frequency bands, for example, a plurality of circuit components such as a demultiplexer are mounted on a multilayer substrate of a single high-frequency circuit. In this case, if a plurality of circuit components are mounted on the multilayer substrate, the size of the multilayer substrate will be increased. Therefore, for example, a module has been proposed in which, instead of using a plurality of antennas for each frequency band, a common antenna is used for a plurality of freq...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H04B1/40H01P1/15
CPCH01Q21/0006H01P1/10H04B1/0057H01P1/15H01Q1/50
Inventor 村濑永德山本宗祯
Owner MURATA MFG CO LTD
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