Technology for cutting heat-free arrayed waveguide grating wavelength division multiplexer

Abstract

The invention discloses the technology for cutting a heat-free arrayed waveguide grating wavelength division multiplexer. The technology includes the following steps: (1) enabling a specially-manufactured metal cutting disc to be arranged on a machine, (2) placing three bases provided with chips in a spliced mode on the metal cutting disc, enabling the three bases to be aligned with three screw holes respectively, placing screws into the three screw holes, locking the screws, conducting zero setting on the height of a blade and the heights of the metal bases with a specific position height measurement method, inputting relevant parameters such as the heights into the cutting machine, and finally adjusting the cutting position to conduct cutting, and (3) loosening the screws to take out the screws after cutting is completed, and completing the cutting working procedure. The technology is simplified in technological process and convenient to operate, so that the production efficiency is greatly improved; the cost is low, so that other auxiliary devices such as consumable items are not required; the accuracy is high, so that manual measurement errors are avoided, and the production yield is improved.

Description

technical field [0001] The invention is specifically a cutting process of an athermal arrayed waveguide grating wavelength division multiplexer. Background technique [0002] At present, there are several methods for realizing athermal AWG. Among them, the planar waveguide mobile type has been researched and explored by major manufacturers. The method is simple and reliable, but the technical difficulty of planar waveguide cutting has not been overcome. Some substrate manufacturers have used the cutting method and its process. Complex, low yield. The traditional cutting process is to use a high-precision cutting machine to install a precision cutting blade. After the blade is installed, use the cutting disc height measurement method to set the height of the blade and the cutting disc to zero, and then bond the chip to a special metal base with a special glue , and then attach the base of the bonded chip to the UV film, input the pre-measured thickness of the UV film, metal ...

AI Technical Summary

Problems solved by technology

However, since the chip is in an inverted V shape with a very small angle, only one side needs to be cut during cutting. The horizontal cutting position of the machine is calculated from the longitudinal centerline of the cutting disc to both sides. In order to avoid uncut or overcut When the UV film is attached, the longitudinal centerline of one side of the chip must be aligned with the longitudinal centerline of the cutting disc. The operation is quite responsible and the position is quite strict; The price of the cutting machine is quite expensive; because the cutting blade is very thin and brittle, it cannot cut metal, otherwise the blade may have problems such as chipping and missing corners, and the chips cut by such a blade are unqualified