Cooling water treatment device, method and substrate treatment device thereof
A cooling water treatment and cooling water technology, applied in the direction of ion implantation plating, coating, electrical components, etc., can solve the problems of cooling water leakage, cooling water pollution, etc., to prevent pollution, solve external leakage, and shorten replacement time. Effect
Active Publication Date: 2016-05-25
AP SYST INC
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Problems solved by technology
However, when the back plate 31 is separated from the magnet module case 20, the cooling water in the inner space of the magnet module case 20 leaks to the outside.
Leaked cooling water will flow to the inside of the chamber or the bottom of the cleaning chamber to cause contamination
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[0030] Hereinafter, embodiments of the present invention will be described in further detail with reference to the drawings. However, the present invention is not limited to the embodiments described below, but can be expressed in various forms that are different from each other. This embodiment is to make the disclosure of the present invention complete, and to fully inform those skilled in the art provided within the scope of the invention. In the drawings, the same symbols refer to the same components.
[0031] figure 2 is a diagram showing the structure of a substrate sputtering apparatus according to an embodiment of the present invention.
[0032] In the following description, a substrate processing device to which a cooling water treatment device is applied will be used as an example as a sputtering device, but it is not limited thereto. In addition to the sputtering device, the cooling water treatment device can also be applied to various substrates processing devi...
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The present invention relates to a cooling water treatment apparatus and treatment method, and a substrate treatment apparatus to which the treatment apparatus and treatment method are applied, and in particular, to a cooling water treatment apparatus and a cooling water treatment method that prevent leakage of cooling water when a target is replaced, and a cooling water treatment apparatus to which the treatment apparatus and treatment method are applied The substrate processing apparatus of the cooling water processing apparatus. The cooling water treatment device according to the embodiment of the present invention includes: a cooler for supplying and recovering cooling water to the shell of the object to be cooled; a cooling water supply pipe and a cooling water recovery pipe for connecting the shell of the object to be cooled and the cooler, respectively; The air inflow body selectively injects air into the shell of the body to be cooled; the cooling water discharger, when working in the discharge mode, in order to interrupt the supply of cooling water to the shell of the body to be cooled, the cooling water supply pipe is converted and connected to The cooling water recovery pipe is used to recover cooling water, and air is injected into the body to be cooled through the air inflow body to discharge the cooling water remaining inside the body to be cooled to the cooling water recovery pipe.
Description
technical field [0001] The present invention relates to a cooling water treatment device and a treatment method and a substrate treatment device to which the treatment device and the treatment method are applied, in particular to a cooling water treatment device and a cooling water treatment method in which the cooling water does not leak out when the target is replaced, and the application of the cooling water treatment method The substrate processing device of the cooling water processing device. Background technique [0002] In the manufacturing process of semiconductor devices, thin films, especially metal layers, are formed by physical vapor deposition (Physical Vapor Deposition: hereinafter referred to as PVD) methods such as sputtering (sputter) and chemical vapor deposition (Chemical Vapor Deposition: CVD) methods. . [0003] For the sputtering method, during the deposition process, the target generates high heat due to the collision of ions on the target surface. ...
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IPC IPC(8): C23C14/34C23C14/35
CPCH01L21/203
Inventor 李宰承金俊浩赵相铉李昞日
Owner AP SYST INC