A fully automatic solder dipping machine

Abstract

The invention discloses a full-automatic tin dip-soldering machine which comprises a machine body, a transmission mechanism installed on the machine body and a control circuit used for controlling the transmission mechanism. The transmission mechanism comprises an upper linear module and a lower linear module which are used for controlling horizontal direction movement and arranged in parallel, a left linear module and a right linear module which are used for controlling perpendicular direction movement and arranged in parallel and stepping motors. The upper linear module and the lower linear module are respectively provided with a sliding table used for fixedly connected the left linear module and the right linear module, the left linear module and the right linear module are respectively provided with a sliding table connected with a circuit board clamp. The control circuit is connected with each stepping motor and drives and controls the corresponding linear module to work. The method that the human hands are simulated by the machine is adopted so that the whole tin dip process can be completed, the advantages of manual dip soldering are kept, the defects of hand operation are overcome, the manufacturing technique is guaranteed, and the workload of workers is reduced.

Description

technical field [0001] The invention relates to a soldering machine, in particular to a fully automatic dipping soldering machine. Background technique [0002] In the assembly and production process of electronic products, electronic parts are usually installed on the printed circuit board and then soldered. At present, the commonly used methods mainly include "manual dip soldering", "wave soldering", "reflow soldering", etc. "Soldering" is only applicable to the soldering of surface mount components. The soldering of through-hole components is still dominated by "manual dip soldering" and "wave soldering", and "manual dip soldering" and "wave soldering" are also applicable to Soldering of some surface mount components. [0003] The process of "manual dip soldering": Put tin in a tin pot and heat the tin pot to a temperature of about 280°C to melt the tin; apply flux on the printed circuit board and component pins, usually using printed circuit Dip the soldering surface a...

AI Technical Summary

Problems solved by technology

[0006]The advantages of "wave soldering" are complete automation, good process consistency, and high efficiency. When the tin wave peaks, the molten tin accelerates to contact with the air, the tin oxidizes faster, produces more tin ash and tin slag, consumes a lot of tin, the temperature of molten tin cools down quickly, and consumes a lot of power

The advantage of "manual dip soldering" is that the equipment is simple, the tin capacity of the tin pot is small, the power consumption is low, and the generation of tin ash and tin slag is less. For working in a high temperature environment, there are high requirements for the operator's craft and physical fitness

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