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Composition for an FPCB coverlay and method for producing the same

A circuit substrate, flexible printing technology, applied in the direction of printed circuit manufacturing, printed circuit, printed circuit, etc., can solve the problems of thickness deviation, lower productivity, lower overall characteristics, etc., achieve excellent flexibility and electrical characteristics, increase design freedom, The effect of shortening the production time

Inactive Publication Date: 2014-03-26
比科麦斯株式会社
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

As a result, productivity is greatly reduced
[0006] In particular, among conventional coverlay films, polyimide has a relatively high heat resistance of 280°C, but epoxy is as low as 150°C or below, so the overall thermal stability is insufficient. , there may be a problem of circuit stripping
In addition, although the polyimide layer has excellent flexibility and electrical properties, the epoxy as a binder has low flexibility and electrical properties, so the overall properties will also decrease.
[0007] Furthermore, when using the existing polyimide, there is a problem that air bubbles are generated or the polyimide sticks to the mask mesh used in printing, so that the mesh is clogged and printing cannot be performed after one or more times.
In addition, bubbles, thickness deviations, and shape differences may occur on the surface of the flexible printed circuit board after printing

Method used

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  • Composition for an FPCB coverlay and method for producing the same
  • Composition for an FPCB coverlay and method for producing the same
  • Composition for an FPCB coverlay and method for producing the same

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Embodiment Construction

[0032] Hereinafter, the present invention will be specifically described through preferred embodiments.

[0033] First, a polyimide is synthesized to prepare the composition for a covering layer of the present invention. Polyimide is a polymer resin formed by polymerization of acid anhydride and amine. First, polyamic acid (PAA, Polyamic Acid) is synthesized by polymerizing acid anhydride and diamine monomers, and adding additives to prepare polyimide.

[0034]As the acid anhydride (dianhydride) used at this time, there are pyromellitic dianhydride (PMDA, pyromellitic dianhydride), phthalic anhydride (PA, phthalic anhydride), 3,3'4,4'-biphenyl Tetracarboxylic dianhydride (BPDA, 3,3′4,4′-biphenyltertracarboxylic dianhydride), 3,3′4,4′-benzophenone tetracarboxylic dianhydride (BTDA, 3,3′4,4′- benxophenonetetracar boxylic dianhydride), 4′4-oxydiphthalic anhydride (ODPA, 4′4-oxydiphthalic anhydride), ethylene glycol bis-trimellitic anhydride (TMEG, trimellitic ethylene glycol), ...

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Abstract

Provided is a composition for an FPCB coverlay and a method for producing the same. The composition for a coverlay according to an embodiment of the invention may include 10.0-45.0 wt % of polyimide, 0.01-5.0 wt % of a defoaming agent, 0.01-5.0 wt % of a leveling agent, 0.01-5.0 wt % of a dispersing agent, 0.1-15.0 wt % of modified polyimide, and a remainder of a solvent. Also provided is a method for producing a composition for a coverlay for an FPCB that includes: placing amine and an acid anhydride in a reaction solvent and subjecting to first polymerization; placing an acid anhydride in a separate reaction solvent subjecting to second polymerization; forming a polyamic acid by mixing a product of the first polymerization with a product of the second polymerization; and adding a defoaming agent, a leveling agent, a dispersing agent, and modified polyimide to the polyamic acid. Also provided is a method of forming a polyimide coverlay on an FPCB that includes: preparing a mask over a circuit of an FPCB, the mask having a desired printing pattern; applying the liquid polyimide composition of over an opening of the mask; and curing the PCB having the polyimide composition applied thereto.

Description

technical field [0001] The present invention relates to a composition for a cover layer of a flexible printed circuit board and a preparation method thereof. its preparation method. Background technique [0002] Solder resist is used to protect the circuit after the circuit pattern is formed on the printed circuit board. Important characteristics of the solder resist are circuit protection, insulation, heat resistance, and the like. Solder resist is used for most printed circuit boards such as single-sided, multi-layer boards, packaging boards, and rigid-flex boards. Solder resist hardens and loses its flex properties after curing. [0003] On the other hand, in flexible printed circuit boards that require three-dimensional wiring, coverlay films are used as circuit protection materials instead of solder resists. Flexible printed circuit board companies form circuit patterns on flexible copper clad laminates (FCCL), and attach a cover film as an insulating film on the ci...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09D179/08C09D7/12C08G73/10H05K3/28
CPCC08G73/1067C08G73/1085C09D179/08H05K3/281H05K3/285H05K2201/0154C08L79/08C08G73/10C08K3/36H05K3/28H05K1/0373
Inventor 宋宗锡
Owner 比科麦斯株式会社
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