Thermoplastic conductive slurry
A kind of conductive paste and thermoplastic technology, applied in the field of flexible substrate and thermoplastic conductive paste, to achieve the effect of good fluidity, easy dispersion and easy grinding
Inactive Publication Date: 2014-03-26
张明
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- Summary
- Abstract
- Description
- Claims
- Application Information
AI Technical Summary
Problems solved by technology
In the prior art, when the conductive paste is used on a flexible substrate, due to the poor fluidity of the conductive paste, it is not easy to pass through the mesh, resulting in missing printing and increasing the defective rate
Method used
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Experimental program
Comparison scheme
Effect test
Embodiment 1
[0011] A thermoplastic conductive paste, its components and parts by weight are: 30 parts of ethyl cellulose, 6 parts of polyvinyl alcohol epoxy resin, 12 parts of diethylene glycol monobutyl ether acetate, and 65 parts of 3 μm flake silver powder.
Embodiment 2
[0013] A thermoplastic conductive paste, its components and parts by weight are: 30 parts of ethyl cellulose, 4 parts of polyvinyl alcohol epoxy resin, 10 parts of diethylene glycol monobutyl ether acetate, and 70 parts of 4μm flake silver powder.
Embodiment 3
[0015] A thermoplastic conductive paste, its components and parts by weight are: 30 parts of ethyl cellulose, 3 parts of polyvinyl alcohol epoxy resin, 9 parts of diethylene glycol monobutyl ether acetate, and 70 parts of 5 μm flake silver powder.
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The invention provides thermoplastic conductive slurry. The thermoplastic conductive slurry includes polymer resin, solvent and conducting materials. The polymer resin is ethylcellulose and polyvinyl alcohol. The solvent is diethylene glycol monobutyl ether acetic ester. The conducting materials are silver powder. The thermoplastic conductive slurry is especially applicable to printing of flexible substrates.
Description
technical field [0001] The invention relates to a thermoplastic conductive paste, which belongs to the field of electronic materials. technical background [0002] Conductive paste is widely used in electronics, information, electroplating and other industries, and is mainly used for conductive bonding between objects. In the prior art, when the conductive paste is used on the flexible substrate, due to the poor fluidity of the conductive paste, it is difficult to pass through the mesh, resulting in missing printing and increasing the rate of defective products. Contents of the invention [0003] The object of the present invention is to provide a thermoplastic conductive paste which is especially suitable for printing on flexible substrates. [0004] In order to achieve the above object, a kind of thermoplastic conductive paste of the present invention comprises polymer resin, solvent and conductive material, and described polymer resin is ethyl cellulose and polyvinyl...
Claims
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IPC IPC(8): H01B1/22
Inventor 张明
Owner 张明