Manufacturing method of partial hybrid printed circuit board

Abstract

The invention discloses a manufacturing method of a partial hybrid printed circuit board. The manufacturing method comprises the following steps that core boards and prepregs are provided, and the core boards into which a high-frequency material needs to be embedded are correspondingly overlapped according to the positions where the high-frequency material needs to be embedded, wherein each prepreg is arranged between two adjacent core boards into which the high-frequency material needs to be embedded; the overlapped core boards are pressed to form a first multi-layer board; a through groove where the high-frequency material needs to be embedded is milled at the position, where the high-frequency material needs to be embedded, of the first multi-layer board, and the high-frequency material is embedded into the through groove of the first multi-layer board. By the adoption of the manufacturing method, the process of milling the prepregs in the prior art is omitted, the phenomenon that the first multi-layer board is inconsistent in thickness due to the fact that too much glue flows out of the positions close to the through groove, of the core boards into which a high-frequency material needs to be embedded is avoided, the alignment precision between the core boards is improved, the quality of the partial hybrid PCB is improved, and working efficiency is improved.

Description

technical field [0001] The invention relates to a method for manufacturing a printed circuit board, in particular to a method for manufacturing a partially mixed-pressed printed circuit board. Background technique [0002] With the 3G high-frequency transmission technology and digital wireless processing technology, higher requirements are put forward for PCB substrate materials, CTE (thermal expansion coefficient) matching, resistance to CAF (ion migration), Dk (dielectric constant), Df (dielectric Loss) and so on have higher requirements. In the traditional PCB design process, if high-frequency signals need to be used, the design is usually made of high-frequency materials for the entire layer, which not only increases the number of layers but also increases the cost. In the context of the increasing cost of PCB processing today, using PCB local The method of mixed pressure, that is, to embed high-frequency materials into the PCB board partially, and replace the whole lay...

AI Technical Summary

Problems solved by technology

However, when there are many layers of core boards to be embedded with high-frequency materials, such as figure 2 As shown, it needs to embed high-frequency materials on the two connected core boards. However, there is a prepreg between the core boards, so it will involve the process of milling the prepreg. There may be the following two hidden dangers in the production process: First, it is easy to cause the core board to be affected by the milling of the prepreg, which makes it difficult to control the expansion and contraction of the prepreg, thus affecting the alignment; second, it is easy to cause the thickness of the dielectric layer between the core board and the core board near the mixed pressure and high frequency position to be seriously low , reduced reliability, poor product quality

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