Method for etching cutting of glass substrate

A glass substrate and etching technology, applied in glass production, glass cutting devices, glass manufacturing equipment, etc., can solve problems such as unfavorable glass manufacturing, reducing process controllability, increasing heat release, etc.

Pending Publication Date: 2014-04-02
THE CHEMOURS CO FC LLC
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

For example, low concentrations of hydrofluoric acid cause slow etch rates, etched glass with sharp cut edges (corners) and severe side etch (see figure 1 ), which are not conducive to the application of etched cut glass to the manufacture of electronic devices
The use of high concentration of hydrofluoric acid can increase the etching rate, but it will also increase the release of heat and reduce the controllability of the process

Method used

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  • Method for etching cutting of glass substrate
  • Method for etching cutting of glass substrate
  • Method for etching cutting of glass substrate

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Embodiment Construction

[0024] All publications, patent applications, patents, and other references mentioned herein are hereby expressly incorporated by reference in their entirety, unless indicated to the contrary, as if fully disclosed herein.

[0025] Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. In case of conflict, the definitions in this specification shall prevail.

[0026] All percentages, parts, ratios, etc., are by weight unless otherwise indicated.

[0027] As used herein, the term "prepared from" is synonymous with "comprising". As used herein, the terms "comprises," "including," "has," "containing," or any other variation thereof, are intended to cover a non-exclusive inclusion. For example, a composition, step, method, article, or device comprising listed elements is not necessarily limited to those elements, but may include other elements not e...

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Abstract

The invention relates to a method for the etching cutting of a glass substrate. An etching cutting solution used by the method includes about 10.1-20wt% of hydrofluoric acid, about 5-20wt% of glycollic acid, about 0-30wt% of nitric acid and about 30-84.9wt% of water, the weight percentage content of each of the above components is based on the total weight of the etching cutting solution, and the etching cutting solution basically contains no ammonium fluoride. The invention also relates to a glass substrate. The glass substrate is obtained through the method. Compared with glass substrates obtained after the etching cutting through a solution only containing hydrofluoric acid, the cut glass substrate in the invention has the advantages of less lateral etching and large corner angle.

Description

technical field [0001] The present invention relates to a method of etching cut glass substrates using an etch cutting solution of hydrofluoric acid, glycolic acid and optionally nitric acid. Background technique [0002] Strengthened glass is a type of glass that has greater strength than conventional glass through controlled heat or chemical processing. Due to its safety and strength, strengthened glass is used in a variety of demanding applications, including electronic devices, passenger car windows, shower doors, architectural glass doors and tables, refrigerator trays, as components of bulletproof glass, in Diving masks and various types of panels and kitchenware. Combining thinness, lightness, and impact resistance, strengthened glass can be used as a cover glass for electronic devices, including liquid crystal displays, handheld devices, tablet computers, mobile phones, portable media players, and laptop computer monitors. [0003] Large-scale strengthened glass su...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C03C15/00
CPCC03B33/023C03C15/00Y02P40/57
Inventor 吕勇军李泰城
Owner THE CHEMOURS CO FC LLC
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