Array substrate and production method thereof
An array substrate and substrate technology, applied in the field of array substrate and its preparation, can solve the problem of metal being easily corroded, and achieve the effect of avoiding metal being easily corroded
Active Publication Date: 2014-04-02
BOE TECH GRP CO LTD +1
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Problems solved by technology
[0005] The object of the present invention is to provide an array substrate and its preparation method to solve the problem that the metals of the gate metal layer and the source-drain metal layer are easily corroded after cutting the array substrate prepared by the existing technology
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[0055] The implementation process of the embodiment of the present invention will be described in detail below in conjunction with the accompanying drawings. It should be noted that the same or similar reference numerals represent the same or similar elements or elements having the same or similar functions throughout. The embodiments described below by referring to the figures are exemplary only for explaining the present invention and should not be construed as limiting the present invention.
[0056] An embodiment of the present invention provides an array substrate, including:
[0057] a substrate;
[0058] A plurality of signal lines formed by the metal layer, the signal lines are disconnected in the cutting area of the substrate;
[0059] A plurality of connection leads, the connection leads are arranged on the adjacent layer of the signal line, the position of the connection lead corresponds to the disconnection of the signal line, and is in direct contact with the ...
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The invention discloses an array substrate and a production method thereof which aim at solving the problem that metal of a metal layer is easy to corrode after the array substrate is cut. The array substrate comprises a substrate, a plurality of signal lines and a plurality of connecting leads; the signal lines are disconnected in the cutting area of the substrate; the connecting leads are formed by the metal layer and arranged on an adjacent layer of the signal lines; the connecting leads are corresponding to the disconnected position of the signal lines and are in direct contact with the signal lines; two ends of the disconnected position of the signal lines are electrically connected with each other through the connecting leads. According to an embodiment, the adjacent layer of grid lines or and data lines is provided with the connecting leads which are formed by inert materials, the two ends of the disconnected position of the grid lines or and the data lines are connected with each other through the connecting leads, and accordingly the problem that the metal is easy to corrode after the array substrate is cut is solved.
Description
technical field [0001] The present invention relates to the field of display technology, in particular to an array substrate and a preparation method thereof. Background technique [0002] Among flat panel display technologies, thin film transistor (Thin Film Transistor, TFT) liquid crystal display (Liquid Crystal Display, LCD) has the characteristics of low power consumption, relatively low manufacturing cost and no radiation, so it occupies a dominant position in the flat panel display market. A lead pad (Lead PAD) area is provided on the periphery of the TFT array substrate and the color filter substrate to the box. The main function of the Lead PAD area is to add test signals to detect electrical characteristics during the preparation of the array substrate. Such as figure 1 , figure 2 , is the design structure of the Lead PAD region corresponding to the gate line of the current mainstream TFT array substrate and its cross-sectional schematic diagram at A-A. Such as...
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IPC IPC(8): G02F1/1362H01L27/12H01L21/77
CPCH01L27/124G02F1/13458G02F1/136254H01L27/1244H01L27/1262H01L27/127
Inventor 胡海琛郤玉生刘家荣
Owner BOE TECH GRP CO LTD