Wiring boards and packages, and electronic devices

Abstract

[Problem] To provide a wiring board in which cracking can be prevented from occurring in the wiring board even when a lid body is bonded to the wiring board. Also to provide a package provided with the wiring board, and an electronic device. [Solution] This invention has: a substrate bottom (1a) having a placement surface (1aa), for placing an electronic component (9), on one principal surface; a substrate bank (1b) provided on the substrate bottom (1a) so as to surround the placement surface (1aa); and an extended part (5) provided at a portion (corner part (1c)) at which the principal surface of the substrate bottom (1a) and the side surface of the substrate bank (1b) intersect, the extended part (5) being integral with the substrate bottom (1a) and the substrate bank (1b).

Description

technical field [0001] The present invention relates to a wiring board, a package, and an electronic device that require airtight sealing. Background technique [0002] Examples of electronic components that require hermetic sealing include crystal-applied products such as crystal oscillators, semiconductor devices such as flash memories, MEMS (Micro Electro Mechanical Systems), and SAW (Surface Accoustic Wave (surface acoustic wave)) devices. Each of the above products is housed in a case such as a ceramic package and hermetically sealed in order to protect the device from the influence of the outside air. [0003] Figure 11 It is an exploded perspective view showing an example of a conventional ceramic package (hereinafter, sometimes referred to as a ceramic package) for mounting display electronic components. A ceramic package for mounting electronic components such as crystal-applied products is constituted by forming a conductor 102 on the surface of a ceramic substra...

AI Technical Summary

Problems solved by technology

[0010] However, in order to reduce the size of the ceramic package, the thickness t of the substrate bottom 101A constituting the ceramic substrate 101 and the width of the portion where the ceramic substrate 101 and the lid 107 are bonded ( Figure 11 Among them, the width W) of the substrate bank 101B of the ceramic substrate 101 is narrowed, but when the substrate bottom 101A of the ceramic substrate 101 and the thickness of the substrate bank 101B are thinned, the strength of the ceramic substrate 101 itself is reduced, for example 101 When bonding the cover 107, etc., there is a problem that cracks are likely to occur on the ceramic substrate 101 due to thermal stress due to the difference in thermal expansion coefficient between the ceramic substrate 101 and the cover 107.

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