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Novel powder plasma processing device

A plasma and processing device technology, applied in the field of ion plasma processing devices, can solve the problems of incomplete processing, poor processing effect, unevenness, etc., and achieve the effects of improving work efficiency, uniform processing effect, and saving time

Inactive Publication Date: 2014-04-16
SUZHOU OPS PLASMA TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In the prior art, when the plasma treatment device treats the surface of the powder, due to the accumulation of the powder and the agglomeration of the particles, the surface not exposed to the plasma atmosphere cannot be treated, and it is difficult to realize the complete treatment of the surface of the particles, resulting in poor treatment Complete, uneven, poorly processed

Method used

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  • Novel powder plasma processing device
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Embodiment 1

[0020] Such as figure 1 As shown, as the first preferred embodiment, this embodiment provides a novel powder plasma treatment device, including a feed chamber 3, a screw feeding mechanism, a reaction chamber 7, an electrode assembly 8, a plasma generator, and a collection chamber 13 And the negative pressure device 5, the top of the reaction chamber 7 is provided with a gas inlet 6 for the introduction of the reaction gas, the upper part of the reaction chamber 7 is provided with a feed port (not shown in the figure), and the bottom of the reaction chamber 7 is provided with a discharge port (Fig. not shown in ), the feeding chamber 3 is connected to the feeding port, the screw feeding mechanism is arranged between the feeding chamber 3 and the feeding port, the electrode assembly 8 is arranged on the outer surface of the reaction chamber 7 and is located below the feeding port, the plasma The bulk generator is electrically connected to the electrode assembly 8, the collection...

Embodiment 2

[0024] Such as figure 2 As shown, the rest are the same as in Embodiment 1, the difference is that this embodiment also includes a cyclone separator 11, and the cyclone separator 11 is arranged between the negative pressure device 5 and the reaction chamber 7, and the bottom of the cyclone separator 11 is connected with the first Two collection chambers 14 .

[0025] In this embodiment, a cyclone separator 11 is added to separate the powder material brought out by the reaction gas from the reaction gas. The powder material is collected by the second collection chamber 14, and the reaction gas is extracted by the negative pressure device 5, and the powder is collected for the second time. materials, effectively avoiding the extraction of powder materials with the reaction gas, saving raw materials and being more environmentally friendly.

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Abstract

The invention relates to a novel powder plasma processing device which comprises a feeding cavity, a reaction cavity, an electrode assembly, a plasma generator, a collecting cavity and a negative pressure device. A gas inlet where reaction gas is led is formed in the top of the reaction cavity, a feeding opening is formed in the upper portion of the reaction cavity, a discharging opening is formed in the bottom of the reaction cavity, the feeding cavity is connected with the feeding opening, the electrode assembly is arranged on the outer surface of the reaction cavity and located below the feeding opening, the plasma generator is electrically connected with the electrode assembly, the collecting cavity is connected with the discharging opening, and the negative pressure device is respectively connected with the feeding cavity and the reaction cavity. According to the novel powder plasma processing device, powder materials are blown by the reaction gas in the process of entering the reaction cavity so that the processing effect can be even, the vacuum degree of the reaction cavity is kept in the feeding process of the feeding cavity, feeding can be carried out without stopping processing, time is saved, and the work efficiency is improved.

Description

technical field [0001] The invention belongs to the field of plasma processing devices, and more specifically relates to a novel powder plasma processing device. Background technique [0002] Plasma is an ionized gas-like substance composed of atoms deprived of some electrons and positive and negative electrons generated after atoms are ionized. It exists widely in the universe and is often regarded as a substance other than solid, liquid, and gas. The fourth state of existence. [0003] At present, plasma devices generally set two electrodes in a sealed container to form an electric field, and use a vacuum pump to achieve a certain degree of vacuum. As the gas becomes thinner, the distance between molecules and the free movement distance of molecules or ions becomes longer and longer. Under the action of an electric field, they collide to form ions. These ions are highly active and their energy is enough to destroy almost all chemical bonds and cause chemical reactions on ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01J37/32
Inventor 王红卫沈文凯
Owner SUZHOU OPS PLASMA TECH
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