Polishing method and polishing device for ultra-thin and brittle workpieces

Abstract

The invention discloses an ultrathin and fragile workpiece polishing method and polishing device. The polishing device is characterized in that a working platform on which a workpiece is placed horizontally moves horizontally and linearly below a rotatable polishing disk; in the horizontal linear moving process of the working platform, a dynamic pressurizing device is used for keeping applying set pressure strength to the workpiece through the polishing disk arranged on an elevating frame, and the workpiece is polished through the working face of the polishing disk. The polishing device comprises the rotatable polishing disk arranged on the frame and the working platform on which the workpiece is placed horizontally, wherein the frame is provided with the dynamic pressurizing device for applying set pressure strength to the workpiece through the polishing disk, and a driving device for driving the working platform to move horizontally and linearly below the polishing disk; in the horizontal linear moving process of the working platform, the polishing disk arranged on an elevating frame is used for keeping applying set pressure to the workpiece. By adopting the method and the device, the defects existing in the conventional polishing are overcome, the polishing device is reasonable in design, the production efficiency is increased greatly, and a basis is laid for the realization of assembly line production.

Description

technical field [0001] The invention relates to a polishing method and a polishing device for a material, in particular to a polishing method and a polishing device for an ultra-thin and brittle workpiece, in particular to a polishing method such as glass, sapphire, piezoelectric crystal, single crystal silicon wafer A polishing method and a polishing device for workpieces. Background technique [0002] In order to make the surface of ultra-thin and brittle workpieces such as glass, sapphire, piezoelectric crystal, and single crystal silicon wafers smooth, transparent, and shiny, the surface usually needs to be polished. At present, the basic structure of the curved surface polishing machine in use is the structure of the upper plate (polishing plate) and the lower plate. Grinding speed, the second is to make the workpiece polished evenly. At the same time, during the whole movement process, because the contact area between the polishing disc and the working platform remai...

AI Technical Summary

Problems solved by technology

However, due to the rotating motion of the polishing disc and the working platform, there is a difference in the linear speed between the outer ring and the inner ring of the polishing disc and the working platform, which leads to poor polishing uniformity of the workpiece on the working platform and leaves flaws on the workpiece. Such as polishing lines, etc., affect the polishing effect and efficiency; at the same time, because the workpieces are all placed in the working platform, when the phenomenon of "frying machine" (that is, debris) occurs, all the workpieces in the working platform will be scrapped, making the process. The yield rate is low (generally around 80%), resulting in high production costs

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