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Method for silicon substrate APD (Avalanche Photodiode) infrared sensitivity enhancement

A silicon-based, sensitive technology, applied in electrical components, circuits, semiconductor devices, etc., can solve problems such as low absorption efficiency and failure to meet market demand, and achieve the effect of enhancing infrared sensitivity

Active Publication Date: 2014-04-23
HARBIN INST OF TECH
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

However, domestic silicon-based APDs with higher quantum response at 1064nm and high-quality and cheap silicon-based APD arrays with larger sensing areas still do not meet market demand.
There are two reasons that restrict the application of silicon-based APDs in this direction. First, the band gap of silicon at 300K is 1.12eV, which leads to the cut-off of silicon’s absorption of light at 1100nm; second, silicon is an indirect band gap material, which leads to the actual The absorption efficiency of medium-silicon-based APD devices is very low near the cut-off wavelength

Method used

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  • Method for silicon substrate APD (Avalanche Photodiode) infrared sensitivity enhancement

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Embodiment Construction

[0015] The technical solution of the present invention will be further described below in conjunction with the accompanying drawings, but it is not limited thereto. Any modification or equivalent replacement of the technical solution of the present invention without departing from the spirit and scope of the technical solution of the present invention should be covered by the present invention. within the scope of protection. It should be noted that all the drawings are in a very simplified form and use inaccurate scales, and are only used for the purpose of conveniently and clearly assisting in describing the specific embodiments of the present invention.

[0016] The method for infrared sensitivity enhancement of silicon-based APD of the present invention, the specific steps are as follows:

[0017] 1. Provide an epitaxial wafer as a silicon-based APD raw material substrate, the epitaxial wafer includes a silicon substrate and a silicon epitaxial layer, wherein the silicon s...

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Abstract

The invention relates to a method for silicon substrate APD (Avalanche Photodiode) infrared sensitivity enhancement, which belongs to the manufacturing field of photoelectric detectors. According to the method, a femtosecond irradiation doping process is carried out on a substrate of a silicon substrate APD under an SF6 gas atmosphere. According to the method, femtosecond laser is utilized to irradiate a silicon wafer under the SF6 gas atmosphere, so that the infrared sensitivity in a near-infrared area is obviously enhanced, the quantum detection efficiency at a 1064nm wave band is improved to 30 percent from original 13 percent, the cut-off wavelength of silicon substrate APD absorption-photons is extended, and the application of a silicon substrate APD device in near-infrared small-signal detection, the photo-communication field and the laser industry can be further expanded.

Description

technical field [0001] The invention belongs to the field of photodetection device manufacture and relates to a method for enhancing infrared sensitivity of a silicon-based APD. Background technique [0002] Silicon is widely used in the semiconductor field to manufacture semiconductor devices, but since the band gap of silicon is 1.12eV, the absorption of infrared light by silicon is greatly limited. Due to the development of the communication industry and the wide application of 1064nm lasers, it is urgent to expand the response width of APD. More advanced avalanche photodiodes (APDs) have been designed and constructed. However, domestic silicon-based APDs with high quantum response at 1064nm and silicon-based APD arrays with high quality and low price and large sensing area still do not meet the market demand. There are two reasons that restrict the application of silicon-based APDs in this direction. First, the band gap of silicon at 300K is 1.12eV, which leads to the ...

Claims

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Application Information

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IPC IPC(8): H01L31/18H01L31/107
CPCH01L31/107H01L31/1864
Inventor 孙芳魁
Owner HARBIN INST OF TECH
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