Packaging structure applied to long-pulse-width and high-power semiconductor laser

Abstract

The invention discloses a packaging structure applied to a long-pulse-width and high-power semiconductor laser. The packaging structure comprises a high-temperature hard solder, a semiconductor laser bar, a p-surface secondary heat sink, an n-surface secondary heat sink, an electric insulation cooling fin, a soft solder and a heat sink, wherein the p-surface secondary heat sink, the n-surface secondary heat sink, the semiconductor laser bar, the high-temperature hard solder piece and the electric insulation cooling fin are stacked according to a certain structure and a certain sequence to form a laser bar stack through one-time or multi-time high-temperature backflow molding; the stack and the heat sink are subjected to backflow welding molding through the soft solder with relatively low temperature. According to the technical scheme, the temperature difference between a p surface and an n surface is small under the working condition of laser, the cooling efficiency is high, the stress-strain difference caused by the temperature difference is effectively reduced, and on the premise that the service life, conversion efficiency and other photoelectric performances of a device are not affected, the device of the structure can be used under the condition that the current duty ratio reaches 40 percent, namely the pulse width is 1-400mS.

Description

technical field [0001] The invention belongs to the technical field of lasers, and in particular relates to a packaging structure of a high-power semiconductor laser applied to a long pulse width. Background technique [0002] In 1960, Maiman manufactured the first ruby ​​laser, which opened the prelude to laser medicine. In 1961, the ruby ​​laser was first applied to the treatment of ophthalmic diseases, creating a precedent for the application of laser in medicine. With the development of laser medicine and The application of laser in various fields continues to deepen, and can be widely used in the diagnosis and treatment of various diseases such as internal medicine, surgery, women, children, eyes, ENT, skin, and plastic surgery. With the expansion of the wavelength range of semiconductor lasers, semiconductor lasers have been used in soft tissue resection, tissue bonding, coagulation, and vaporization, and have been widely used in medicine, as shown in Table 1. Semicon...

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Problems solved by technology

[0013] The purpose of the present invention is to overcome the above problems in the prior art, provide a hard solder packaging structure, effectively solve and avoid the problem of heat dissipation difference between the n-plane and p-plane caused by long pulse working conditions, and effectively alleviate the heat dissipation of the n-plane and p-plane. Stress and strain problems, so that it can have high brightness, high reliability, high efficiency and other characteristics under long pulse conditions

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