Thermal module for biochemical reaction

A technology of biochemical reaction and vapor chamber, which is applied in the thermal module field of biochemical reaction, can solve the problems of low usability, poor temperature regulation ability, poor heat conduction uniformity, etc., and achieve good heating consistency and good temperature uniformity , The effect of simple technical structure

Active Publication Date: 2014-04-30
XIAN TIANLONG SCI & TECH
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  • Claims
  • Application Information

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Problems solved by technology

[0007] In view of the deficiencies in the prior art, the purpose of the present invention is to provide a thermal module for biochemical reactions, which solves the problems of poor temperature regulation, low ease of use, and uniform heat conduction of existing thermal

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  • Thermal module for biochemical reaction
  • Thermal module for biochemical reaction
  • Thermal module for biochemical reaction

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Embodiment Construction

[0041] Specific embodiments of the present invention are provided below, and it should be noted that the present invention is not limited to the following specific embodiments, and all equivalent transformations done on the basis of the technical solutions of the present application all fall within the scope of protection of the present invention. It should be noted that the application of the thermal module of the present invention is not limited to thermal modules used for biochemical reactions, and other similar principles or schemes should also be included within the protection scope of the present invention.

[0042] The working principle of the uniform temperature chamber structure is as follows: the cavity of the airtight shell maintains a vacuum state, and the working fluid can use the capillary state to flow between the cavity of the airtight shell, the working fluid return layer and the support column. When the working medium is heated and evaporates, The working flui...

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Abstract

The invention provides a thermal module for biochemical reaction. The thermal module is characterized in that a semiconductor heating-cooling fin is arranged on the bottom surface of a pedestal, wherein a thermal interface material layer is arranged between the top surface of the semiconductor heating-cooling fin and the bottom surface of the pedestal, a soaking plate is arranged on the bottom surface of the semiconductor heating-cooling fin, a thermal interface material layer is arranged between the bottom surface of the semiconductor heating-cooling fin and the top surface of the soaking plate, and the bottom surface of the soaking plate is mounted on cooling fins; a soaking plate temperature-equalizing cavity structure is machined in the soaking plate, and a pedestal temperature-equalizing cavity structure is machined in the pedestal. According to the thermal module, the temperature-equalizing cavity structure is arranged in the pedestal, the heating uniformity of the pedestal is high due to the temperature uniformity property of each point and ultra-low thermal resistance of a temperature-equalizing cavity, and the temperature uniformity of a test tube in each test tube hole is good; furthermore, by arranging the temperature-equalizing cavity structure between the pedestal and each cooling fin, two key problems of rapid heat transfer and uniform heat transfer are solved.

Description

technical field [0001] The invention belongs to the field of biochemical reaction instruments, in particular to a thermal module for biochemical reactions. Background technique [0002] The reaction and storage of biochemical reagents usually need to meet certain temperature conditions. At present, there are many instruments that can control the temperature of the reaction and storage of biochemical reagents, which are widely used in the reactions of various enzymes and the storage of various biochemical samples. Representative instruments for biochemical reactions include high-resolution melting curve instruments, polymerase chain reaction instruments, and the like. [0003] At present, the thermal modules of these instruments are generally composed of multiple devices that are closely attached from top to bottom, including bases, gaskets, heating and cooling components, and heat dissipation components. One side of the heat dissipation components is equipped with a power su...

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Application Information

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IPC IPC(8): B01L7/00
Inventor 苗保刚彭年才李明李政龚大江姜昊
Owner XIAN TIANLONG SCI & TECH
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