Wafer-level packaging structure, forming method thereof, and packaging method

Abstract

A wafer-level packaging structure and its forming method, as well as a packaging method, wherein the wafer-level packaging structure includes: a wafer to be packaged including several chip areas and dicing line areas between the chip areas, and the wafer to be packaged It includes a first surface and a second surface opposite to the first surface; a bonding pad and a photosensitive element located on the first surface of the wafer chip area to be packaged; a first embankment structure covering the surface of the bonding pad and the dicing line area, located A second dike structure above the dike structure, the width of the second dike structure is smaller than the width of the first dike structure, and the position of the second dike structure corresponds to the position corresponding to the cutting line area; and the to-be-packaged The first surface of the wafer is opposite to the packaging cover, and the packaging cover is fixedly bonded to the wafer to be packaged through the first dike structure and the second dike structure. The invention automatically separates the packaging cover from the wafer to be packaged at the end of the packaging process, so that the performance of the chip formed after the packaging process is more superior.

Description

technical field [0001] The invention relates to semiconductor packaging technology, in particular to a wafer-level packaging structure, a forming method thereof, and a packaging method. Background technique [0002] An image sensor is a sensor that senses external light and converts it into an electrical signal. After the image sensor chip is manufactured, a series of packaging processes are performed on the image sensor chip to form a packaged image sensor for use in various electronic devices such as digital cameras and digital video cameras. [0003] The traditional image sensor packaging method is usually packaged by wire bonding (Wire Bonding). However, with the rapid development of integrated circuits, longer leads make the product size unable to meet the ideal requirements. Therefore, wafer-level packaging (WLP: Wafer Level Package) has gradually replaced wire bonding packaging as a more commonly used packaging method. Wafer-level packaging technology is a technolog...

AI Technical Summary

Problems solved by technology

[0005] However, in the prior art, after the packaging cover is separated from the die in advance, subsequent processes such as etching and cleaning during the packaging process will cause certain damage to the die, which will adversely affect the performance of the image sensor.

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