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A process gate level adjustment device for semiconductor process equipment

A level adjustment device and process equipment technology, which is applied in metal processing equipment, semiconductor/solid-state device manufacturing, metal processing, etc., can solve problems such as large errors, adverse effects on process quality and production capacity, and low efficiency, so as to save time for leveling , improve process quality and productivity, and avoid leveling errors

Active Publication Date: 2016-04-06
BEIJING NAURA MICROELECTRONICS EQUIP CO LTD
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Therefore, this leveling method has large errors and low efficiency, which has an adverse effect on process quality and production capacity.

Method used

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  • A process gate level adjustment device for semiconductor process equipment
  • A process gate level adjustment device for semiconductor process equipment

Examples

Experimental program
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Embodiment Construction

[0025] The specific embodiment of the present invention will be further described in detail below in conjunction with the accompanying drawings.

[0026] In this example, see figure 1 , figure 1 It is a schematic diagram of the installation structure of a process gate level adjustment device for semiconductor process equipment in the present invention on the process gate. The level adjusting device of the present invention is used for adjusting the level of process gates of semiconductor process equipment during disassembly and assembly. As shown in the figure, the lower end surface of the process door 6 is connected to the triangular fixed plate 10 through three support columns 7 , 8 , 9 . There are 3 horizontal adjustment devices of the present invention, which are respectively installed vertically near each supporting column (the other 2 horizontal adjustment devices are omitted from the figure, and only the horizontal adjustment device 5 is used as an example for illustr...

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Abstract

The invention provides a process door level adjusting device for semiconductor process equipment. The process door level adjusting device is vertically mounted near a support pillar between the process door and a fixed disc, and comprises a tubular housing, wherein screw threads are formed at the lower end of the inner wall of the tubular housing and an adjusting screw is mounted on the lower end, the lower end of the adjusting screw is connected with the fixed disc; a slider with a scale is mounted on the upper end of the housing, a compression spring is mounted in the housing between the slider and the adjusting screw, and the upper end of the slider is in contact with the process door. The spring in the housing is driven, by virtue of a displacement generated by the housing of the level adjusting device rotates relatively to the adjusting screw, to drive the slider to rise or fall, and as a result, direct observation and real-time adjustment on the levelness of the process door are realized, and moreover, a leveling error can be avoided, the time of leveling can be saved and the quality and yield of the process can be improved.

Description

technical field [0001] The invention relates to a level adjustment device for semiconductor integrated circuit process equipment, more particularly, to a level adjustment device for determining and adjusting the process gate level of semiconductor integrated circuit process equipment. Background technique [0002] The process door of the semiconductor integrated circuit process equipment is used to close the thermal reaction tube to prevent the loss of heat energy in the thermal reaction tube, as well as the leakage of process gas or the entry of external gas. If the seal between the process door and the furnace mouth of the thermal reaction tube is not good, it will directly affect the uniformity of the film thickness of the silicon wafer during the process. [0003] The levelness of the process door is the main index to measure the installation quality of the process door, which directly affects the sealing of the furnace mouth and the uniformity of the film thickness of t...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B23P19/10
CPCH01L21/6719H01L21/67242
Inventor 张骏柳文涛
Owner BEIJING NAURA MICROELECTRONICS EQUIP CO LTD
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