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Pump type scraper head matched device

A scraper head and pump-type technology, which is applied in the field of pump-type scraper head supporting devices, achieves the effects of weight reduction, simple extrusion and injection, and easy implementation

Active Publication Date: 2014-05-07
HONGYI TECH AUTOMATION EQUIP HUIZHOU CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] However, the inventors have found that there is currently no more comprehensive pump-type scraper head supporting device that can realize precise automatic control of the pump-type scraper head

Method used

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  • Pump type scraper head matched device
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  • Pump type scraper head matched device

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Experimental program
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Embodiment Construction

[0047] In order to facilitate the understanding of those skilled in the art, the present invention will be further described in detail below in conjunction with the accompanying drawings and embodiments:

[0048] Such as Figure 2-9 As shown, the present invention discloses a pump-type scraper head matching device capable of accurately and automatically controlling the pump-type scraper head 10 . When applying solder paste to the PCB board, by using this pump-type scraper head matching device, the solder paste can be automatically extruded and sprayed, and filled on the solder pad of the circuit board through the stencil.

[0049] refer to figure 2 , the supporting device of the pump scraper head, including:

[0050] a first driving assembly for driving the lifting movement of the first pressing rod;

[0051] a second driving assembly for driving the lifting movement of the second pressing rod;

[0052] A sensor assembly for sensing the position signals of the first and s...

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PUM

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Abstract

The invention relates to a pump type scraper head matched device. The pump type scraper head matched device comprises a first drive assembly, a second drive assembly, a sensor assembly and a controller, and further comprises an installation assembly, a guide assembly and an even number of shock absorption mechanisms. The first drive assembly is used for driving a first pressing rod to rise and fall. The second drive assembly is used for driving a second pressing rod to rise and fall. The sensor assembly is used for sensing a position signal of the first pressing rod and a position signal of the second pressing rod. The controller is connected with the sensor assembly and controls the first drive assembly and the second drive assembly. The installation assembly is used for installation of a pump type scraper head. The guide assembly plays a role in guiding horizontal installation of the pump type scraper head. The even number of shock absorption mechanisms are arranged inside a first supporting part, divided into two sets and evenly and symmetrically distributed on the two edges with a rotating shaft serving as a center line. According to the pump type scraper head matched device, a pump type scraper head can be accurately and automatically installed and controlled, solder paste can be automatically extruded and jetted, and the amount of extruded solder paste can be accurately controlled.

Description

technical field [0001] The invention relates to a matching device for a pump type scraper head. Background technique [0002] Printed circuit boards are the core components of electronic products such as computers and home appliances. When making printed circuit boards, semi-solidified solder paste is printed on a special PCB in a certain pattern, so that electronic components such as semiconductor chips and resistors can be mounted on the printed PCB. A series of actions of applying solder paste on the PCB board is completed by special equipment, which is called a solder paste printing machine. The scraper head of the solder paste printing machine leaks the solder paste on the PCB through the specific opening pattern set on the stencil, and the electronic components such as chips are mounted on the PCB area covered with the solder paste. [0003] In order to increase the solder paste coating efficiency and improve the coating effect, the applicant previously invented a pu...

Claims

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Application Information

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IPC IPC(8): B41F31/04
Inventor 俞元根
Owner HONGYI TECH AUTOMATION EQUIP HUIZHOU CO LTD
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