Electronic component

Abstract

In an electronic component including an external terminal member and an insulating section contacting with the external terminal member while taking a specified surface side of the external terminal member as an exposed portion, when melted solder is applied onto the external terminal member, a part of the insulating section may melt or a crack may enter the insulating part sometimes. The exposed part (27) of the external terminal member (23) of the invention is provided by a base plating film (32) and an outer plating film (33), wherein the base plating film is made of nickel or a nickel alloy and the outer plating film which is placed on the base plating film and is made of gold, tin, or an alloy containing at least one of gold and tin. The outer plating film (33) is formed in a mode that a relatively thin region (36) surrounding a relatively thick region (37). The amount of metal having good solder wettability in the relatively thin region is small (36) and the base plating film is likely to be oxidized. Therefore, the periphery of the exposed portion (27) of the external terminal member (23) is reduced in solder wettability so that the spread of the solder can be suppressed.

Description

technical field [0001] The present invention relates to an electronic component, and particularly to an electronic component that includes an electrically insulating insulating portion and an external terminal member embedded in the insulating portion, and is mounted with solder applied to the external terminal member. Background technique [0002] As a technique related to the present invention, it is described in, for example, JP-A-2011-100998 (Patent Document 1). Especially in Patent Document 1 figure 1 as well as image 3 describes a case of an electric double layer capacitor composed of a concave main body and a lid. The case is made of resin, and the external terminal member is embedded in the case. Figure 5 In FIG. 2 , the above-mentioned structure is generalized, and a state in which the external terminal member 1 is fitted into the case 2 serving as an insulating portion is shown in a cross-sectional view. [0003] Such as Figure 5 As shown, when the electron...

AI Technical Summary

Problems solved by technology

In addition, when the melted high-temperature solder 7 comes into contact with the case 2 made of resin, a part of the case 2 will melt or cracks 8 will occur.

[0004] For example, in the case of an electronic component such as an electric double layer capacitor using an organic electrolytic solution, the capacitor element and the organic electrolytic solution are housed in the case 2, and the intrusion of moisture from the outside is strictly prohibited. The problem

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