Light emitting device

Abstract

Disclosed are a light emitting device, a method of manufacturing a light emitting device, a light emitting device package, and a lighting system. The light emitting device includes: a substrate; a first conductive semiconductor layer on the substrate; an active layer on the first conductive semiconductor layer; a second conductive semiconductor layer on the active layer; A through hole formed through the substrate contacts the first via electrode with the first conductive semiconductor layer; and a second through hole formed through the substrate, the first conductive semiconductor layer, and the active layer contacts with the first via electrode. The second conductive semiconductor layer is in contact with the second via electrode.

Description

technical field [0001] The present embodiment relates to a light emitting device, a method of manufacturing a light emitting device, a light emitting device package, and a lighting system. Background technique [0002] A light emitting device (LED) includes a PN junction diode having a characteristic of converting electrical energy into light energy. A PN junction diode can be produced by using a compound semiconductor including group III-V elements in the periodic table. By adjusting the composition ratio of compound semiconductors, light emitting devices can exhibit various colors. [0003] LEDs according to the related art may be classified into lateral type LEDs and vertical type LEDs according to positions of electrode layers. [0004] Meanwhile, according to the LED packaging technology of the related art, the flip chip LED is based on a lateral type LED, and a hole injection semiconductor layer and an active layer are etched to form an N-type electrode. Therefore, ...

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Problems solved by technology

Therefore, the light emitting area can be reduced so that the luminous flux can be reduced

[0005] In addition, since the flip-chip LED according to the related art is based on a lateral type LED, the flow of carriers is diffused so that the current is concentrated, so that the luminous efficiency decreases

[0006] In addition, the flip-chip LED according to the related art uses electrodes exhibiting low optical transmittance, and makes the electrodes reflect light so that light is extracted through the sapphire substrate, so light extraction efficiency may be reduced

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