Heat-preservation device of photoresist pipeline casing pipe

A heat preservation device and photoresist technology, applied in heat preservation, pipeline protection, pipe/pipe joint/pipe fittings, etc., can solve problems affecting process accuracy, process, production capacity, etc., achieve good effect of constant temperature and heat preservation, and improve quality and efficiency, easy maintenance effect

Active Publication Date: 2014-05-21
SHENYANG KINGSEMI CO LTD
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0002] At present, in the semiconductor production process, the photoresist needs to be kept at constant temperature and heat preservation in the glue coating unit. The water inlet and return water of the traditional casing heat preservation system are two independent pipe systems, with more connection points and large volume. , is not convenient for production and maintenance, eas

Method used

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  • Heat-preservation device of photoresist pipeline casing pipe
  • Heat-preservation device of photoresist pipeline casing pipe

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Embodiment Construction

[0017] The invention will be further described below in conjunction with the accompanying drawings.

[0018] Such as figure 1 , figure 2 As shown, the present invention is provided with a double-layer casing structure on the outside of the photoresist tube 9, the inner layer of the double-layer casing structure is a water inlet pipeline, and the outer layer is a water outlet pipeline, forming a self-closed circulation constant temperature pipeline, One end of the photoresist tube 9 is connected to the photoresist nozzle 1 , and the other end is connected to an external supply pipeline.

[0019] The double-layer sleeve structure includes a nozzle joint 2, an inner sleeve 3, an outer sleeve 4, a heat exchange block joint 5, a heat exchange block 6, and a photoresist tube locking joint 8, and the photoresist tube 9 passes through the inner sleeve 3 Passing through, both ends of the inner casing 4 are respectively connected to the nozzle joint 2 and the heat exchange block join...

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Abstract

The invention relates to a heat-preservation device of a gluing unit photoresist pipeline in the production of semiconductors, in particular to a heat-preservation device of a photoresist pipeline casing pipe. The outer face of a photoresist pipe is provided with a double-layer casing pipe structure, the inner layer of the double-layer casing pipe structure is a water inlet pipeline, the outer layer of the double-layer casing pipe structure is a water outlet pipeline, and a self-closed circulation constant-temperature pipeline is formed. One end of the photoresist pipe is connected with a photoresist nozzle, and the other end of the photoresist pipe is connected with an external supply pipeline. The heat-preservation device of the photoresist pipeline casing pipe is good in heat-preservation effect, and capable of saving space and improving production quality and production efficiency.

Description

technical field [0001] The invention relates to a thermal insulation device for a photoresist pipeline of a coating unit in semiconductor production, in particular to a thermal insulation device for a photoresist pipeline casing. Background technique [0002] At present, in the semiconductor production process, the photoresist needs to be kept at constant temperature and heat preservation in the glue coating unit. The water inlet and return water of the traditional casing heat preservation system are two independent pipe systems, with more connection points and large volume. , is not convenient for production and maintenance, is easy to leak, and takes up more space. At the same time, single-layer insulation is likely to cause temperature fluctuations and affect process accuracy. In many cases, the replacement of single-layer casings is time-consuming and laborious, which seriously affects production capacity. Sometimes, due to the efficiency of single-pass constant temperat...

Claims

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Application Information

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IPC IPC(8): F16L59/16
CPCF16L53/32
Inventor 王阳
Owner SHENYANG KINGSEMI CO LTD
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