Heat-preservation device of photoresist pipeline casing pipe

Abstract

The invention relates to a heat-preservation device of a gluing unit photoresist pipeline in the production of semiconductors, in particular to a heat-preservation device of a photoresist pipeline casing pipe. The outer face of a photoresist pipe is provided with a double-layer casing pipe structure, the inner layer of the double-layer casing pipe structure is a water inlet pipeline, the outer layer of the double-layer casing pipe structure is a water outlet pipeline, and a self-closed circulation constant-temperature pipeline is formed. One end of the photoresist pipe is connected with a photoresist nozzle, and the other end of the photoresist pipe is connected with an external supply pipeline. The heat-preservation device of the photoresist pipeline casing pipe is good in heat-preservation effect, and capable of saving space and improving production quality and production efficiency.

Description

technical field [0001] The invention relates to a thermal insulation device for a photoresist pipeline of a coating unit in semiconductor production, in particular to a thermal insulation device for a photoresist pipeline casing. Background technique [0002] At present, in the semiconductor production process, the photoresist needs to be kept at constant temperature and heat preservation in the glue coating unit. The water inlet and return water of the traditional casing heat preservation system are two independent pipe systems, with more connection points and large volume. , is not convenient for production and maintenance, is easy to leak, and takes up more space. At the same time, single-layer insulation is likely to cause temperature fluctuations and affect process accuracy. In many cases, the replacement of single-layer casings is time-consuming and laborious, which seriously affects production capacity. Sometimes, due to the efficiency of single-pass constant temperat...

AI Technical Summary

Problems solved by technology

[0002] At present, in the semiconductor production process, the photoresist needs to be kept at constant temperature and heat preservation in the glue coating unit. The water inlet and return water of the traditional casing heat preservation system are two independent pipe systems, with more connection points and large volume. , is not convenient for production and maintenance, easy to leak, and takes up more space

At the same time, single-layer insulation is likely to cause temperature fluctuations and affect process accuracy. In many cases, the replacement of single-layer casing is time-consuming and laborious, which seriously affects production capacity. Sometimes, due to the single-pass constant temperature efficiency, it affects the result of the process.

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