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Light emitting device inserted with current homogenizing structure and manufacturing method thereof

A technology for light-emitting devices and manufacturing methods, which is applied in the direction of electrical components, semiconductor devices, circuits, etc., can solve problems such as reducing the working life of devices, limiting the rated power of devices, and breakdown of light-emitting devices, so as to reduce light shading and uniform current distribution , to enhance the effect of lateral flow

Inactive Publication Date: 2014-05-21
INST OF SEMICONDUCTORS - CHINESE ACAD OF SCI
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The current edge effect can easily cause local overheating and breakdown of the light-emitting device, which will reduce the working life of the device and limit the rated power of the device
For ordinary power diodes, the current collector effect is a common problem. When designing the device structure and electrode wiring, it is always necessary to minimize the influence of the current collector effect on the rated power and working life of the device.
In addition, the current edge effect will greatly reduce the luminous efficiency

Method used

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  • Light emitting device inserted with current homogenizing structure and manufacturing method thereof
  • Light emitting device inserted with current homogenizing structure and manufacturing method thereof
  • Light emitting device inserted with current homogenizing structure and manufacturing method thereof

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Embodiment Construction

[0024] In order to make the object, technical solution and advantages of the present invention clearer, the present invention will be described in further detail below in conjunction with specific embodiments and with reference to the accompanying drawings.

[0025] In the drawings, for convenience and clarity of explanation, the thickness or size of each layer may be exaggerated, reduced or schematically shown, and the size of each constituent part does not necessarily or may not necessarily reflect its actual size.

[0026] Hereinafter, a method of manufacturing the light emitting device according to the first embodiment will be described in detail with reference to the accompanying drawings. Figure 1 to Figure 3 It is a process flow chart of manufacturing a light-emitting device inserted with a homogenizing current structure according to the first embodiment of the present invention.

[0027] refer to figure 1 , the n-type semiconductor layer 31 , the active layer 50 , th...

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Abstract

The invention discloses a light emitting device inserted with a current homogenizing structure and a manufacturing method thereof. The light emitting device inserted with the current homogenizing structure comprises a first electrode layer, a p type degeneration semiconductor layer on the first electrode layer, an n type degeneration semiconductor layer on the p type degeneration semiconductor layer, a p type semiconductor layer on the n type degeneration semiconductor layer, an active layer on the p type semiconductor layer, an n type semiconductor layer on the active layer, and a second electrode layer on the n type semiconductor layer. By adopting the light emitting device, the current distribution uniformity during working of the semiconductor device can be improved effectively, the photo, electrical and thermal performance of the semiconductor device is improved, and the service life is prolonged.

Description

technical field [0001] The invention belongs to the technical field of semiconductors, in particular to a light-emitting device inserted with a homogenizing current structure and a manufacturing method thereof. Background technique [0002] The electrode area of ​​the light-emitting surface of the light-emitting device always only occupies a small part of its corresponding working area. The current injected by the device is likely to be concentrated near the electrode and cannot be effectively spread throughout the entire device, resulting in injection into the junction area. The current distribution is uneven, this effect is called the current edge effect. The current edge effect can easily cause local overheating of the light-emitting device and cause breakdown, which will reduce the working life of the device and limit the rated power of the device. For ordinary power diodes, the current collector effect is a common problem. When designing the device structure and electr...

Claims

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Application Information

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IPC IPC(8): H01L33/14H01L33/00
CPCH01L33/14H01L33/145
Inventor 郭恩卿伊晓燕刘志强陈宇王军喜李晋闽
Owner INST OF SEMICONDUCTORS - CHINESE ACAD OF SCI
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