Thin copper baffle bracket for vertical PCB (printed circuit board) plating line

Abstract

The invention discloses a thin copper baffle bracket for a vertical PCB (printed circuit board) plating line. The thin copper baffle bracket comprises a plating conductive plate bracket, an upper telescopic column, a lower telescopic column, an upper telescopic column embedded groove, a lower telescopic column embedded block, a fall stopping edge, a fixed annular ring and an adjustable annular ring embedded groove. The thin copper baffle bracket is characterized in that one end of the upper telescopic column is fixed with plating conductive plates by screws; the upper telescopic column and the lower telescopic column are nested together by the fixed annular ring for fixed connection; the adjustable annular ring embedded groove is nested on the lower telescopic column; the upper telescopic column embedded groove is formed in the upper telescopic column; and the lower telescopic column embedded block is arranged at the other end of the lower telescopic column. According to the thin copper baffle bracket for the vertical PCB plating line, current unbalance caused by electric conduction of the bracket can be prevented, the telescopic range of the bracket is wide, and the plating requirement of a conventional PCB with any size can be met, and with the adoption of the thin copper plate, the purchasing cost and the purchasing price difference of waste copper and the copper plate can be reduced.

Description

technical field [0001] The invention relates to a PCB electroplating device, in particular to a thin copper baffle bracket for a PCB vertical electroplating line. Background technique [0002] The vertical electroplating of the circuit board factory needs to place a stainless steel plate or copper plate with good conductivity on the outer side of the copper clad plate on the flybar or at the pinch point with insufficient width to balance the current, so as to avoid excessive current density at the edge of the outer copper clad plate and thicker coating, which will affect the subsequent Processes such as graphics transfer and product quality. The uniform current density of the baffle and the potion can realize the traditional vertical electroplating production of HDI boards, which ensures the product quality and the production cost is lower than the average level of the same industry. Due to the high price, low hardness and non-recyclable use of copper baffles, copper baffle...

AI Technical Summary

Problems solved by technology

However, the use of stainless steel baffles requires etching, grinding, etc. to strip the copper layer on the surface. Dissolve the copper on the baffle first, and then recover the copper through extraction, stripping and electrolysis, which will generate new waste water and waste gas pollutants, and the recovery cost is high; while using physical grinding to strip copper produces noise pollution, and it is easy to polish the cloak Cause industrial accidents, the polished stainless steel baffle is contaminated with dust, thread glove fibers, etc., and it is brought into the electroplating tank to affect the quality of the potion and production quality

From the functional point of view, the use of thick copper plates can have the strength of stainless steel baffles to press the floating tank in the electroplating tank into the bottom of the tank, and at the same time achieve the purpose of distributing the circuit board current. However, the purchase cost of thick copper plates is high, and the price loss after sales is large. And the thick copper plate is not easy to clamp

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