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LED light source packaged with thin-wall ceramic lens

An LED light source and LED chip technology, applied in electrical components, electric solid state devices, circuits, etc., can solve the problems of poor light source quality and affect the normal use of light sources, and achieve the effect of avoiding blue damage

Inactive Publication Date: 2014-05-28
张红卫
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0003] But at present, when the flat ceramic phosphor is used as a cover plate for packaging, there are often serious edge chromatic aberrations such as yellow edges, green edges, red edges, and blue edges, as well as "colorful" problems caused by differences in light components on the light-emitting surface. The quality of the light source is poor, affecting the normal use of the light source

Method used

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  • LED light source packaged with thin-wall ceramic lens
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  • LED light source packaged with thin-wall ceramic lens

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Embodiment Construction

[0019] The above content has fully described the present invention, and the implementation of the present invention will be further described below in conjunction with the accompanying drawings, but the implementation of the present invention is not limited thereto.

[0020] refer to Figure 1 to Figure 2 , is only a preferred embodiment of an LED light source packaged with a thin-walled ceramic lens in the present invention. The thin-walled ceramic lenses are respectively in the shape of a hollow hemisphere and a hollow box.

[0021] Sinter the thin-walled lens-type ceramic blank obtained by injection molding, dry pressing molding, gel injection molding, extrusion molding, slip casting or tape casting at high temperature at 1000-1900 °C, and then at 800 °C Annealing at -1700°C to obtain thin-walled transparent ceramics. The ceramic transmittance reaches the theoretical transmittance without post-processing.

[0022] In this example, an LED light source packaged by a thin-w...

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Abstract

The invention provides an LED light source packaged with a thin-wall ceramic lens. The LED light source packaged with the thin-wall ceramic lens comprises an LED chip, an electrode connection wire, an LED support, a packing material and the thin-wall ceramic lens. The thin-wall ceramic lens is fixed to the support, and the chip is completely covered with the thin-wall ceramic lens. The support and the thin-wall ceramic lens form a hollow inner cavity, and the inner cavity can be filled with the packing material at the time of packaging. The thickness of the thin-wall ceramic lens ranges from 0.05 mm to 2 mm. The thin-wall ceramic lens can be in the shape of a hemisphere or a semi-ellipsoid or a square box or a rhombus or an angle or a hyper-hemisphere or a Fresnel lens according to the packaging requirement of the LED light source. According to the LED light source packaged with the thin-wall ceramic lens, the LED light source is packaged in the form of the thin-wall ceramic lens, so that the optical paths of chip light to all parts of the lens are identical, and edge chromatic aberration of yellow edges, red edges, green edges and the like and the five-color problem of the packaged LED light source can be effectively eliminated; meanwhile, since the chip light is completely sealed in the lens, harm of blue light can be effectively avoided; by the selection of the packing material, the phenomenon that ceramic cracks due to a thermal gradient can be effectively prevented, and the lighting effect is enhanced.

Description

technical field [0001] The invention relates to the field of ceramic preparation and the field of LED lighting technology, in particular to an LED light source packaged with a thin-walled ceramic lens. Background technique [0002] In recent years, LED ceramic packaging technology, as a new packaging technology, uses transparent ceramic phosphors instead of "phosphor + silica gel". Due to its high thermal conductivity, high quantum efficiency, anti-color fading, and no aging, it can replace phosphors at the same time , Sealing glue, lamp housing, low cost and other traditional packaging technologies have unparalleled advantages and have developed rapidly. Famous institutions such as Philip Luminleds and Kyoto University in the world are engaged in research and development in this area. [0003] But at present, when the flat ceramic phosphor is used as a cover plate for packaging, there are often serious edge chromatic aberration problems such as yellow edges, green edges, r...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L25/075H01L33/58
Inventor 张红卫李华陈宝容冯辉辉
Owner 张红卫
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