Low-temperature wafer bonding method
A wafer bonding, low temperature technology, applied in instruments, welding equipment, optomechanical equipment, etc., can solve the problems of low bonding strength, limitation, limited use temperature of devices, etc., to achieve the effect of high efficiency and avoid damage
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[0029] In order to make the object, technical solution and advantages of the present invention clearer, the present invention will be described in further detail below in conjunction with specific embodiments and with reference to the accompanying drawings.
[0030] This low-temperature wafer bonding method provided by the present invention first cleans the two wafers, then deposits a thin oxide layer on the bonding regions of the two wafers respectively, and removes the oxide layer deposited on at least one of the wafers. Surface activation treatment is carried out, and the oxide layers of the two processed wafers are relatively pasted together, and finally sent to the bonding machine to apply extrusion force, so as to realize the bonding of the two wafers.
[0031] like figure 1 as shown, figure 1 A flow chart of a method for low temperature wafer bonding according to an embodiment of the present invention is shown, and the method includes the following steps:
[0032] Ste...
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