Assembly structure and method of an optical device

Abstract

The invention discloses an assembly structure of an optical optical device, which includes a first optical device and a second optical device, and also includes a first T-shaped sleeve, a second T-shaped sleeve, and a ball joint pair with an optical hole. , the first optical device is fixed in the first T-shaped sleeve tube, the second optical device is fixed in the second T-shaped sleeve tube, the first T-shaped sleeve and the second T-shaped sleeve The T surface end of the shaped sleeve is connected by a ball joint pair, and the concave ball joint and the convex ball joint of the ball joint pair are welded and fixed. The invention obtains a highly temperature-stable connection mode, which makes the adjustment of optical elements more convenient, accurate and greatly reduces the stress caused by temperature changes, improves the temperature stability of the system, and makes the assembly and fixing more efficient and reliable.

Description

technical field [0001] The invention relates to an assembly structure and method of an optical device. Background technique [0002] In the field of communication, optical passive devices have very high requirements on device reliability due to their different application environments and differences, especially the requirements on temperature reliability, vibration, humidity, etc. are very stringent. The assembly structure and method used in the production process of passive devices will play a key role in the above reliability. For example, in the collimator fixing or connecting structure, it is a conventional means to use the so-called stainless steel metal bridge to connect or fix the collimator, such as figure 1 As shown, it is obvious that in this assembly structure, if the two collimators 1 can obtain a larger adjustment angle range, the inner diameter of the stainless steel bridge 2 must be made larger, so that the thickness of the solder 3 will be thicker during we...

AI Technical Summary

Problems solved by technology

For example, in the collimator fixing or connecting structure, it is a conventional means to use the so-called stainless steel metal bridge to connect or fix the collimator, such as figure 1 As shown, it is obvious that in this assembly structure, if the two collimators 1 can obtain a larger adjustment angle range, the inner diameter of the stainless steel bridge 2 must be made larger, so that the thickness of the solder 3 will be thicker during welding. The structure completely fills the asymmetrically distributed gaps with solder 3, which is prone to large stress, and the thermal expansion coefficient between the solder 3 and the stainless steel bridge 2 is inconsistent, so the asymmetry caused will increase and affect the temperature stability of the entire device. General TDL can reach 0.1 dB

[0003] In addition, there is another type of structure using glass ball joints, which can better improve the above problems, but the disadvantages are that the glass is relatively fragile and has poor mechanical resistance to damage, and the wall thickness of glass ball joints is limited due to mechanical strength. Can not be too thin, so in some devices that require a relatively small size, there are great restrictions on its application

In addition, the structure of the glass ball joint can only be realized by glue bonding due to material limitations, which is a big problem for some devices that require no glue technology.

Of course, glass ball joints can be soldered by coating the surface with a metal film, but there are still a series of problems such as high cost, poor thermal conductivity of glass, and difficult control of the welding process.

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