Unlock instant, AI-driven research and patent intelligence for your innovation.

Wiring substrates, component built-in substrates, and mounting structures

A technology for wiring substrates and built-in substrates, which is applied to circuit substrate materials, printed circuit components, semiconductor/solid-state device components, etc. The effect of improving reliability

Inactive Publication Date: 2016-11-23
KYOCERA CORP
View PDF6 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] However, in general, metals and resins have different thermal expansion coefficients, and when heat is applied to the wiring board, since the difference in thermal expansion in the plane direction between the metal plate and the insulator becomes large, there will be an impact on the metal plate and the insulator. Stress is applied to the boundary surface between the wiring layers, so there is a possibility that the wiring layer is peeled off from the metal plate due to the stress
[0005] As a result, a disconnection occurs in the conductive layer of the wiring board, and the electrical reliability of the wiring board tends to decrease.

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Wiring substrates, component built-in substrates, and mounting structures
  • Wiring substrates, component built-in substrates, and mounting structures
  • Wiring substrates, component built-in substrates, and mounting structures

Examples

Experimental program
Comparison scheme
Effect test

no. 1 Embodiment approach

[0020]

[0021] Below, use Figure 1 ~ Figure 3 , the wiring board according to the first embodiment of the present invention will be described.

[0022] figure 1 The illustrated wiring substrate 1 includes: a metal plate 2 ; and a plurality of wiring layers 5 provided on only one main surface of the metal plate 2 and having a plurality of insulating layers 3 and conductive layers 4 .

[0023] The metal plate 2 is formed of, for example, copper, aluminum, or a metal with high heat conductivity such as an alloy thereof, and functions as a heat dissipation member for dissipating heat generated by electronic components provided on the wiring board 1, and serves as a wiring layer 5. function as a supporting member. Since the end surface of the metal plate 2 is exposed, heat can be favorably dissipated from the end surface.

[0024] In addition, in the wiring board 1 in this embodiment, the wiring layer 5 is provided only on one main surface of the metal plate 2, and the other...

no. 2 Embodiment approach

[0066]

[0067] Below, use Figure 6 , the mounting structure according to the second embodiment of the present invention will be described. In addition, the description of the same configuration as that of the first embodiment described above is omitted.

[0068] The mounting structure 14 of the second embodiment includes: a wiring board 1 having an opened recess 20 on one main surface (the main surface opposite to the metal plate 2 ); and an electronic component 16 which is wire-bonded. installed in the recess 20.

[0069] The concave portion 20 penetrates through each wiring layer 5 of the wiring board 1 in the thickness direction, and exposes a part of the upper surface of the metal plate 2 as a bottom surface. Since the electronic component 16 is mounted on the bottom surface of the concave portion 20 , the wiring layer 5 is not interposed between the electronic component 16 and the metal plate 2 , so that the heat dissipation of the electronic component 16 by the met...

no. 3 Embodiment approach

[0076]

[0077] Below, use Figure 7 ~ Figure 9 , the mounting structure according to the third embodiment of the present invention will be described. Note that descriptions of the same configurations as those of the first and second embodiments described above are omitted.

[0078] The mounting structure 14 according to the third embodiment includes: a component-embedded substrate 25 having a wiring substrate 1 and a built-in component 24 embedded in the wiring substrate 1; and an electronic component 16 mounted on one main surface of the component-embedded substrate 25. (on the main surface on the side opposite to the metal plate 2). In this wiring board 1 , the first solder balls 15 or the second solder balls 19 are connected to the conductive layer 4 formed on one main surface of the component-embedded substrate 25 as in the first embodiment.

[0079] The wiring substrate 1 includes: a first substrate 27 composed of at least one wiring layer 5 and disposed on one main ...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The present invention provides a wiring board that responds to a request for improved reliability of connection with electronic components, a component-embedded board that incorporates components in the wiring board, and a wiring board or a component-embedded board that mounts electronic components. structure. comprising: a metal plate (2); and a wiring layer (5) arranged on at least one main surface of the metal plate (2) and having a plurality of insulating layers (3) and arranged on the plurality of insulating layers (3) ) on the conductive layer (4). The plurality of insulating layers (3) of the wiring layer (5) are provided with: a first insulating layer (6) which is provided in contact with one main surface of the metal plate (2) and has a thermal expansion coefficient in the plane direction larger than that of the metal plate (2). a thermal expansion coefficient in the plane direction; and a second insulating layer (7), which is laminated on the first insulating layer (6) in contact with the first insulating layer (6), and whose thermal expansion coefficient in the plane direction is smaller than that of the metal plate (2) The thermal expansion coefficient in the plane direction. The first insulating layer (6) contains resin (8). The second insulating layer (7) includes a plurality of interconnected first particles (10) made of an inorganic insulating material, and a first insulating layer ( 6) part.

Description

technical field [0001] The present invention relates to a wiring board used in electronic equipment (for example, various audio-visual equipment, home appliances, communication equipment, computer equipment and peripheral equipment thereof), a component-embedded substrate incorporating built-in components in the wiring board, and A mounting structure in which electronic components are mounted on a wiring board or a component-embedded board. Background technique [0002] In recent years, the amount of heat generated by electronic components has been increasing along with the improvement in performance of electronic components used in electronic equipment. Therefore, in order to efficiently dissipate heat generated by electronic components, a metal plate may be used as a core material of a wiring board. [0003] Japanese Patent Application Laid-Open No. 2002-353584 describes a wiring board including a metal plate serving as a core material, and a wiring layer composed of a re...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Patents(China)
IPC IPC(8): H05K1/05H05K3/46
CPCH05K1/185H05K3/4655H05K2201/0195H05K1/056H05K3/4608H05K2201/0209H05K2201/0269H01L23/142H01L23/49894H01L23/5389H01L23/13H01L23/3735H01L23/3737H01L2224/16225H01L24/19H01L2224/04105H01L2224/12105H01L2224/32225H01L2224/32245H01L2224/48091H01L2224/48227H01L2224/73204H01L2224/73265H01L2224/73267H01L2924/15192H01L2924/15321H05K2201/068H01L2924/15153H01L2924/00012H01L2924/00H05K1/0271
Inventor 林桂
Owner KYOCERA CORP