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Semiconductor processing device and method for processing semiconductor wafer

A processing device and semiconductor technology, applied in the manufacture of semiconductor/solid-state devices, discharge tubes, electrical components, etc., can solve the problems of general products and methods without suitable structures and methods, inconvenience, etc.

Inactive Publication Date: 2014-06-18
MACRONIX INT CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0003] It can be seen that the above-mentioned existing semiconductor processing device and the method for processing semiconductor wafers obviously still have inconvenience and defects in product structure, manufacturing method and use, and need to be further improved urgently.
In order to solve the above-mentioned problems, the relevant manufacturers have tried their best to find a solution, but no suitable design has been developed for a long time, and there is no suitable structure and method for general products and methods to solve the above-mentioned problems. This is obviously a problem that relevant industry players are eager to solve

Method used

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  • Semiconductor processing device and method for processing semiconductor wafer
  • Semiconductor processing device and method for processing semiconductor wafer
  • Semiconductor processing device and method for processing semiconductor wafer

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Embodiment Construction

[0068] In order to further explain the technical means and effects of the present invention to achieve the intended purpose of the invention, below in conjunction with the accompanying drawings and preferred embodiments, the specific implementation methods, Structure, method, step, feature and effect thereof are as follows in detail.

[0069] The aforementioned and other technical contents, features and effects of the present invention will be clearly presented in the following detailed description of preferred embodiments with reference to the drawings. Through the description of specific embodiments, it should be possible to obtain a deeper and more specific understanding of the technical means and effects of the present invention to achieve the intended purpose, but the attached drawings are only for reference and description, and are not used to explain the present invention. be restricted.

[0070] see figure 1 Shown is a schematic side perspective view of the interior ...

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Abstract

The invention relates to a semiconductor processing device and a method for processing a semiconductor wafer. The semiconductor processing device comprises a processing chamber, a pedestal and a nozzle. The pedestal is arranged in the processing chamber and used for bearing the semiconductor wafer. The nozzle is used for supplying processing gas to the processing chamber. The invention also provides the method for processing the semiconductor wafer simultaneously.

Description

technical field [0001] The present invention relates to a semiconductor processing device and a method for processing a semiconductor wafer, in particular to a semiconductor processing device for improving the uniformity of material deposition and / or concentration on a semiconductor wafer and a method for processing a semiconductor wafer. Background technique [0002] An important element in the manufacture of reliable integrated circuits is the uniform handling of semiconductor wafers. The deposited thickness or concentration of materials (for example, Boron, Phosphorus, Nitrogen, or other dopant concentrations) across the wafer may will make a difference. These discrepancies may lead to defects in the device or require additional processing steps to correct. For example, if the deposition is not uniform, a longer or more aggressive chemical mechanical planarization (CMP) step may be required. In other examples, when specific boron, nitrogen, phosphorus, nitrogen, or oth...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01J37/32H01L21/02
Inventor 罗兴安
Owner MACRONIX INT CO LTD