Method for growing nitride epitaxial layer on silicon substrate and semiconductor device thereof
A technology of nitride epitaxial layer and silicon substrate, which is applied in the direction of semiconductor devices, electrical components, circuits, etc., can solve the problems of unsatisfactory effect, affecting the crystal quality uniformity of the epitaxial layer, and the difficulty of the aluminum nitride layer process, etc., to achieve Solve cracks and dislocations, improve crystal quality, and enhance device performance
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[0058] The present invention will be described in detail below in conjunction with specific embodiments shown in the accompanying drawings. However, these embodiments do not limit the present invention, and any structural, method, or functional changes made by those skilled in the art according to these embodiments are included in the protection scope of the present invention.
[0059] Furthermore, repeated reference numerals or designations may be used in different embodiments. These repetitions are only for the purpose of simply and clearly describing the present invention, and do not represent any relationship between the different embodiments and / or structures discussed.
[0060] ginseng figure 1 As shown, the method for growing a nitride epitaxial layer on a silicon substrate of the present invention comprises:
[0061] S1. Provide a single crystal silicon substrate;
[0062] S2. Depositing a barrier layer on the single crystal silicon substrate;
[0063] S3, depositi...
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